PCBA Process Engineer

Flex•Buffalo Grove, IL

4d•Hybrid

About The Position

The PCBA (Printed Circuit Board Assembly) Process Engineer is responsible for developing, optimizing, and sustaining manufacturing processes for electronic assemblies. This role focuses on ensuring high‑quality, cost‑effective, and scalable PCBA production through process design, equipment optimization, defect reduction, and continuous improvement across SMT and through‑hole operations.

Requirements

BS Mechanical Engineering, Electrical Engineering or Manufacturing Engineering or equivalent experience
5+ years of experience in PCBA or electronics manufacturing.
Strong understanding of SMT
Hands‑on experience with reflow profiling, solder paste printing, and defect analysis.
Familiarity with IPC standards and electronic assembly quality requirements.
Knowledge of automated equipment systems and tools - robotic, vision, material handling, Conveyors, PLC, HMI, Pick-Place-Pack, Inspection/Tes
Experience using data‑driven problem‑solving tools (DOE, SPC, 8D, Ishikawa).
Knowledge of AOI, SPI, X‑ray inspection, and functional test integration.

Nice To Haves

2 years’ experience working with manufacturing of medical devices
Industrial/Manufacturing Engineering experience working in high-volume assembly processes.
Excellent verbal, written and critical thinking skill
Experience with high speed low mix or regulated manufacturing environments.
Familiarity with lean manufacturing and continuous improvement methodologies (Six Sigma, Kaizen).
Experience supporting automation or Industry 4.0 initiatives.

Responsibilities

Develop, validate, and improve SMT assembly processes including solder paste printing, pick‑and‑place, reflow.
Establish and maintain process parameters, work instructions, control plans, and standard operating procedures.
Lead process characterization (DOE, capability studies) to ensure robust and repeatable manufacturing performance.
Provide day‑to‑day engineering support to production lines to resolve yield, quality, equipment, or throughput issues.
Analyze process data and defect trends using SPC and root‑cause analysis tools to drive corrective actions.
Support ramp‑up of new products from NPI through full production.
Drive defect reduction initiatives targeting solder defects, component damage, alignment issues, and functional failures.
Support PFMEA creation and maintenance for PCBA processes.
Collaborate with Quality Engineering on customer complaints, audits, and corrective/preventive actions.
Define equipment requirements and support selection, qualification, and deployment of SMT and PCBA manufacturing equipment.
Work with maintenance and vendors to optimize equipment performance, uptime, and reliability.
Specify and validate fixtures, stencils, solder profiles, and tooling.
Collaborate with Design Engineering on DFM/DFA reviews to improve manufacturability and testability.
Support Supply Chain with material evaluations, alternate components, and supplier process readiness.
Train operators and technicians on new processes, equipment, and best practices.
Maintain accurate process documentation, change control, and traceability records.
Ensure compliance with IPC standards (e.g., IPC‑A‑610, J‑STD‑001) and internal quality requirements.