PCB Process Engineer - Specialist II

MIT Lincoln Laboratory•Lexington, MA

33d•$100,600 - $136,200

About The Position

The Fabrication Engineering Group (Group 72) provides rapid fabrication, assembly, integration, and test of advanced hardware prototypes for national security applications. Examples include the precision machining of fiber mounts for airborne high-energy laser systems, multi-functional structures using additive processes for ground-based radar systems, custom printed circuit boards for space-borne data processing, and highly integrated mechanical packaging for undersea communication terminals. Core mechanical competencies span precision fabrication, additive manufacturing, and 5-axis machining. Core PCB capabilities include automated solder paste dispensers, precise pick-n-place machines, and automated optical inspection systems. Assembly, integration, and test capabilities include integration spaces, clean rooms, vibration testing, thermal testing, and space simulation chambers. The Group focuses on quality management, operational proficiency, and technical excellence. G72 is seeking an early-to-mid-career process engineer to support PCB assembly operations. Responsibilities may include but are not limited to solder paste jet printer programming, pick-and-place system package programming, reflow process generation and optimization, component processing including gold/tin mitigation and lead-forming, rework planning and assessment, and direct collaboration with engineering staff to solve complex assembly and repair challenges. The successful candidate will demonstrate the ability to address rapidly changing fabrication priorities while helping to ensure the highest quality and reliability of the hardware produced. Opportunities exist for candidates to go beyond daily operations support by spearheading process improvement studies and quality optimization efforts.

Requirements

5 years of experience in an industrial or CM PCB assembly environment
Experience with solder paste jetting system programming, operation, and troubleshooting
Experience with SMT pick-and-place system package generation, system operation, and troubleshooting
Experience with SMT reflow processes and recipe generation
Experience with evaluating and dispositioning PCB assembly rework and repair situations and providing a formal assessment for further evaluation by engineering staff
Experience and demonstrated understanding (via certifications or verified training) with the IPC J-STD-001, IPC-7711/7721, IPC-A-610 standards, especially for Class 3 hardware
U.S. citizenship is required

Nice To Haves

Bachelor’s degree in electrical engineering or equivalent
5-10 years of experience in a high-mix, low-volume PCB assembly prototyping environment supporting complex development and fabrication efforts
Experience using the Aegis FactoryLogix manufacturing execution system (MES) environment
Experience with Mycronic SMT equipment including the MY700 solder paste jet printer, the MY200 and MY300 pick-and-place systems, and the Mycronic solder paste inspection (SPI) and automated optical inspection (AOI) platforms
Experience with vapor phase soldering and the Rehm Thermal Systems Condenso XC soldering system or similar platform
Experience with board rework and repair, including the use of ball-grid-array (BGA) rework systems such as the VJ Electronix Summit 2200i
Experience with component modification including gold and tin mitigation as well as lead-forming of SMT devices
Experience and demonstrated familiarity with the NASA-STD-8739 standards

Responsibilities

Solder paste jet printer programming
Pick-and-place system package programming
Reflow process generation and optimization
Component processing including gold/tin mitigation and lead-forming
Rework planning and assessment
Direct collaboration with engineering staff to solve complex assembly and repair challenges
Spearheading process improvement studies and quality optimization efforts