Packaging Substrate Development Engineer
Advanced Micro Devices, Inc•Austin, TX
•Hybrid
About The Position
In this exciting role you will be leading packaging technology development for supply chain bring up of advanced substrate technologies to support AMD's product roadmap. Ideal will have a hands-on approach with excellent oral and written communication skills to communicate ideas to stakeholders and global cross functional teams.
Requirements
- BS/MS/PhD in solid state physics, Chemistry, Material science, Chemical engineering or equivalent.
Nice To Haves
- Experience leading cross functional teams to achieve technology certification, yield/cost reduction initiatives, equipment set up.
- Communicating complex technical challenges to executive level/management.
- Deep knowledge of packaging and board design rules, process flows, materials, and equipment.
- Proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate and PCB vendors
Responsibilities
- Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors
- Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements
- Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks.
- Partner with product, quality and manufacturing engineering teams to meet various milestones for manufacturability, yield and reliability from concept through NPI.
- Qualify package substrates of new products meeting cost and yield targets.
Benefits
- AMD benefits at a glance.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
