Packaging Module Development Engineer

Intel•Hillsboro, OR

1d•$115,110 - $219,550•Onsite

About The Position

We are seeking a highly motivated, self-driven individual to join Materials Technology Development (MTD), bringing a strong technical background and a demonstrated ability to collaborate effectively across cross-functional teams to drive materials technology development for advanced packaging. The ideal candidate will have a strong educational foundation in Materials Science, such as Metallurgy or Polymer Science or Polymer Chemistry, with an excellent understanding of structure-property-performance correlations in materials and strong functional knowledge of materials characterization tools and techniques. The candidate must be able to apply sound technical problem-solving skills to resolve materials-process-equipment challenges in technology development and drive innovative materials solutions for advanced packaging at Intel. This role requires close collaboration with cross organizational stakeholders to deliver novel materials technologies that meet stringent quality and reliability requirements. The candidate must also be able to work effectively with external materials suppliers and possess strong communication and presentation skills, including the ability to formulate and present materials strategies and development plans in both internal and external forums. Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Requirements

Bachelor's degree with 4+ years of experience or Master's degree with 3+ years of experience or Ph.D in a relevant field such as Materials Science, Metallurgy, Chemical Engineering, Chemistry, Mechanical Engineering, or a related discipline.
4+ years of hands-on experience in packaging module development, process characterization, or equipment optimization.

Nice To Haves

Experience in collaborating with cross-functional teams, suppliers, and manufacturing operations to achieve shared goals.
Proficiency in Design of Experiments (DOE) principles and statistical data analysis tools.
Demonstrated expertise in packaging fundamentals, package design and development, and package testing methodologies.
Knowledge of reliability and quality requirements for semiconductor packaging.
Knowledge of materials structure-property-performance behaviors and materials characterization techniques is highly preferred.

Responsibilities

Develops assembly materials, processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Optimizes and improves the efficiency of manufacturing of packages, developing innovative materials, processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
Develops materials target specifications to ensure excellent integration of materials into packaging equipment and processes meeting quality and reliability targets.
Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure materials technology, quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging materials quality and reliability.
Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
Leads efforts towards innovating, problem solving, developing, and continuously improving materials, equipment and processes using experimental design and statistical methods.
Provides consultation concerning packaging problems and improvements in the packaging process, and responds to customer/client requests or events as they occur.
Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on materials/process/technology maturity for products towards key risk areas in meeting product milestones.