Packaging Module Equipment Development Engineer

Intel Corporation•Chandler, AZ

3d•$133,800 - $188,890•Onsite

About The Position

Develops assembly processes and/or equipment and applies innovative engineering concepts to enable Intel’s future assembly packaging platform technologies. Optimizes and improves manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability goals. Develops process and equipment specifications using principles of design of experiments (DOE), data analysis, and statistical methods to support process development and continuous improvement initiatives. Documents technical findings, improvements, and best practices through technical reports and white papers. Develops, maintains, and evaluates equipment and processes used to assess silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments. Ensures manufacturability of package designs and supports manufacturing process flows, procedures, and implementation activities. Collaborates with cross-functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards are met. Supports process and equipment innovation efforts focused on reliability, quality, and manufacturing efficiency. Leads problem-solving and process improvement activities using experimental design methodologies and engineering analysis techniques. Provides technical consultation related to packaging and manufacturing process improvements and supports customer or stakeholder requests as needed. Continuously partners with packaging technology development and engineering teams to drive process standardization, manufacturing quality improvements, and future technology readiness.

Requirements

Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science Engineering, Industrial Engineering, or a related engineering or science discipline with 5+ years of engineering industry experience; OR Master’s degree in a related engineering field with 3+ years of engineering industry experience; OR PhD in a related engineering field with 6+ months of engineering industry experience.

Nice To Haves

Experience in semiconductor manufacturing and/or advanced packaging technologies.
Experience with packaging process development, assembly equipment, or manufacturing optimization.
Knowledge of reliability testing, failure analysis, and process qualification methods.
Experience working in high-volume manufacturing or technology development environments.
Strong collaboration and communication skills with cross-functional teams and external suppliers.

Responsibilities

Develops assembly processes and/or equipment and applies innovative engineering concepts to enable Intel’s future assembly packaging platform technologies.
Optimizes and improves manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
Develops process and equipment specifications using principles of design of experiments (DOE), data analysis, and statistical methods to support process development and continuous improvement initiatives.
Documents technical findings, improvements, and best practices through technical reports and white papers.
Develops, maintains, and evaluates equipment and processes used to assess silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments.
Ensures manufacturability of package designs and supports manufacturing process flows, procedures, and implementation activities.
Collaborates with cross-functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards are met.
Supports process and equipment innovation efforts focused on reliability, quality, and manufacturing efficiency.
Leads problem-solving and process improvement activities using experimental design methodologies and engineering analysis techniques.
Provides technical consultation related to packaging and manufacturing process improvements and supports customer or stakeholder requests as needed.
Continuously partners with packaging technology development and engineering teams to drive process standardization, manufacturing quality improvements, and future technology readiness.