Packaging Module Equipment Development Engineer

Intel Corporation•Chandler, AZ

3d•$133,800 - $188,890•Onsite

About The Position

Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies. Optimizes manufacturing processes to improve quality, reliability, cost, yield, productivity, and manufacturability. Develops process and equipment specifications using Design of Experiments (DOE), Statistical Process Control (SPC), and data analysis methodologies to drive process optimization and continuous improvement. Documents technical findings, process improvements, and best practices through technical reports and white papers. Develops and maintains equipment used to evaluate silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments. Ensures manufacturability of package designs and supports manufacturing process flows, procedures, and implementation activities. Collaborates with cross-functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards are achieved. Supports innovation efforts focused on process reliability, manufacturing quality, and equipment efficiency. Leads technical problem-solving and process improvement initiatives using experimental design and statistical analysis methods. Provides technical consultation related to packaging and manufacturing process improvements and responds to customer or stakeholder needs as required. Partners with packaging technology development and engineering teams to drive process standardization, manufacturing quality improvements, and technology readiness aligned to product milestones and key risk areas. Our metrology technologies are rapidly evolving toward advanced Artificial Intelligence (AI) and Machine Learning (ML) applications used to process equipment-generated 2D and 3D images from digital camera and ultrasound inspection systems. Current and future Metrology Engineers are expected to develop strong technical capabilities in the following areas: Operating, programming, troubleshooting, and optimizing automated inspection equipment, including hands-on interaction with hardware components such as lighting systems, cameras, transducers, robotic systems, and conveyors. Utilizing software tools to process and analyze inspection images, optimize algorithms and defect detection limits, run iterative analyses, and collaborate with AI experts and automation teams to improve true-defect detection while minimizing false positives and reducing manual operator review. Performing data analysis to identify patterns, understand input/output relationships, and continuously improve inspection system performance and process capability. Partnering with suppliers and cross-functional engineering teams to develop next-generation inspection and metrology technologies capable of detecting new failure modes in future products and materials.

Requirements

Bachelor’s degree in Engineering, Physics, Chemistry, Materials Science, or a related technical field with 5+ years of engineering industry experience including inspection equipment; OR Master’s degree in a related field with 3+ years of engineering industry experience; OR PhD in a related field with 6+ months of engineering industry experience.
Experience with automated inspection tools, image processing algorithms and artificial intelligence.
Semiconductor fabrication processes and technology experience.
Advanced packaging and/or assembly process experience.
Experience with equipment selection, integration, ownership, and change control management systems.
Project management experience delivering results for complex, time-critical technical projects.
Strong technical problem-solving and innovation skills within manufacturing or engineering environments.

Responsibilities

Develops assembly processes and/or equipment and applies innovative engineering concepts to support Intel’s future assembly packaging platform technologies.
Optimizes manufacturing processes to improve quality, reliability, cost, yield, productivity, and manufacturability.
Develops process and equipment specifications using Design of Experiments (DOE), Statistical Process Control (SPC), and data analysis methodologies to drive process optimization and continuous improvement.
Documents technical findings, process improvements, and best practices through technical reports and white papers.
Develops and maintains equipment used to evaluate silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments.
Ensures manufacturability of package designs and supports manufacturing process flows, procedures, and implementation activities.
Collaborates with cross-functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards are achieved.
Supports innovation efforts focused on process reliability, manufacturing quality, and equipment efficiency.
Leads technical problem-solving and process improvement initiatives using experimental design and statistical analysis methods.
Provides technical consultation related to packaging and manufacturing process improvements and responds to customer or stakeholder needs as required.
Partners with packaging technology development and engineering teams to drive process standardization, manufacturing quality improvements, and technology readiness aligned to product milestones and key risk areas.
Operates, programs, troubleshoots, and optimizes automated inspection equipment, including hands-on interaction with hardware components such as lighting systems, cameras, transducers, robotic systems, and conveyors.
Utilizes software tools to process and analyze inspection images, optimize algorithms and defect detection limits, run iterative analyses, and collaborate with AI experts and automation teams to improve true-defect detection while minimizing false positives and reducing manual operator review.
Performs data analysis to identify patterns, understand input/output relationships, and continuously improve inspection system performance and process capability.
Partners with suppliers and cross-functional engineering teams to develop next-generation inspection and metrology technologies capable of detecting new failure modes in future products and materials.