Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

2d•$115,110 - $162,500•Onsite

About The Position

Join Intel’s Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor packaging. In this role, you will develop and optimize cutting-edge equipment and processes that enable next-generation packaging solutions. Your work will directly impact product performance, manufacturability, and reliability at scale supporting innovations that power computing advancements globally.

Requirements

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience. Or a Master's degree in the same field with 2 years of experience and a PhD in the same field.
Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
Mechanical design software such as SolidWorks or AutoCAD.
Mechanical drawings and Geometric Dimensioning and Tolerancing.

Nice To Haves

Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
Experience with high-precision manufacturing methods, including stamping and CNC machining.
Understanding of semiconductor fabrication processes and packaging technologies.
Familiarity with supply chain management in a manufacturing or materials qualification environment.
Previous related work experience in a semiconductor foundry preferred.

Responsibilities

Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality, yield, cost, and reliability targets
Apply statistical methods (DOE, SPC) to analyze process performance and drive continuous improvement
Design and execute experiments to validate packaging technologies under environmental stress conditions (e.g., thermal cycling, humidity, mechanical forces)
Collaborate cross-functionally with design, manufacturing, and suppliers to ensure scalable and manufacturable solutions
Define equipment specifications and partner with vendors to meet technical and performance requirements
Identify and resolve packaging-related reliability issues using data-driven approaches and failure analysis techniques
Lead technical problem-solving efforts and contribute to process innovation initiatives
Document findings and best practices through technical reports and knowledge-sharing forums
Support standardization of qualification processes, quality systems, and engineering methodologies