Packaging Module Development Engineer

Intel•Chandler, AZ

5d•Onsite

About The Position

Materials Technology Development at Intel Corporation is seeking an experienced Packaging Module Development Engineer for packaging materials technology development for co-packaged optical semiconductor assemblies. This role involves working in close collaboration with packaging assembly module teams, package architecture, integration, and assembly, substrate, an optical component materials supply chain, as well as semiconductor vendors and assembly/test providers worldwide. The position requires a strong understanding of optical materials and assembly process, optical component design, manufacturing, and test, active optical alignment processes. This role spans across pathfinding through high volume manufacturing for successful integrated co-packaged optics packages.

Requirements

MS with 3+ years of experience or PhD degree and with 1+ years of work experience post-graduation.
Graduate degree discipline can be in Optics or Photonics Engineering, Materials Sci Eng related to Photonics, Applied Physics, Chemical Engineering, or related fields.
Technical problem-solving, strong presentation and communication skills, fast-learning skills and solid expertise in their technical field, willingness to collaborate effectively as a team player across multiple teams.

Nice To Haves

1+ years of experience in one or more of the following: Semiconductor packaging and optical assembly experience
Optical connector/component design and manufacturing experience
Experience in photolithography materials and process
Ceramics, glass processing

Responsibilities

Conducting fundamental studies and performing experiments to characterize materials, identify potential failure modes, understand the structure-property-performance interactions, assess feasibility of material use on product, and make material technology recommendations.
Working in close collaboration with materials suppliers to develop and source materials formulations that meet technology, quality, availability, and cost targets.
Developing a fundamental understanding of Intel's assembly process and materials interactions and impact on product performance.
Collaborating closely with Materials, equipment and process engineering teams to build material technologies on test vehicles and products and assessing their performance.
Develops materials assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
Develops new techniques and metrologies, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.