Packaging Module Development Engineer

Intel Corporation•Chandler, AZ

1d•$133,800 - $219,550•Onsite

About The Position

As a Packaging Module Development Engineer, you will play a pivotal role in advancing Intel's assembly and packaging technologies. You will develop and optimize processes, equipment, and materials to enable the next generation of innovative packaging solutions. Your daily work will directly contribute to improving manufacturing efficiency and the quality, reliability, and scalability of Intel's products. Join Intel's Substrate Packaging Technology Development (SPTD) organization, a leader in developing cutting-edge substrate and packaging solutions. SPTD enables Intel’s advanced packaging technology roadmap through materials innovation, process optimization, and equipment development, supporting the delivery of affordable, high-performance products to the global market.

Requirements

Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related field, with 6+ years of related experience; OR Master's degree in the above fields, with 4+ years of related experience; OR PhD in the above fields, with 2+ years of related experience.
Proficiency in design of experiments (DOE), statistical data analysis, and/or process control tools.
Semiconductor or packaging processing experience.

Nice To Haves

2+ years of experience with material development such as patternable dielectric materials formulations is a plus.
Hands-on experience with dielectric/photo-resist patterning process development, including lamination or coat/bake/develop optimization, resist profile engineering, and process window characterization
Hands-on experience developing experimental setups to validate modeling and simulation.

Responsibilities

Drive innovation in packaging technology by identifying early-stage reliability issues and developing effective solutions.
Optimize equipment configurations, process specifications, and integration flows to enable advanced packaging technologies.
Collaborate with cross-functional teams to design and execute experiments that evaluate process and material interactions.
Lead continuous improvement initiatives to enhance process capability, stability, productivity, automation, yield, and manufacturability.
Establish material specifications and partner with supplier quality teams to ensure compliance with requirements, with a particular focus on dielectric materials and processes.
Apply statistical methods and design of experiments (DOE) principles to characterize processes, solve complex technical challenges, and improve performance.
Drive the development of next-generation patternable dielectric materials and fabrication processes to scale advanced semiconductor packaging capabilities.
Manage projects to ensure alignment with product development schedules, milestones, and execution goals.
Respond with urgency and professionalism to foundry customer requests, escalations, and manufacturing events.
Document technical advancements through papers and contribute to knowledge sharing across the organization.