GlobalFoundries (GF) is seeking a new college graduate to support the development of industry-leading electro-optical transceivers using GF's Photonix platform and advanced 2.5D and 3D co-packaged optics form factors. This hands-on role will contribute to thermal, mechanical, electrical, and optical chip-package co-design, with an emphasis on product and module performance, reliability, packaging design rules, materials selection, and electrical, photonic, and thermal requirements for chiplet and product modules.
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Job Type
Full-time
Career Level
Entry Level