Packaging Engineering Intern
About The Position
Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.
Requirements
- Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
Responsibilities
- Design, development, and analysis of different semiconductor packaging technologies.
- Participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies.
- Work in material, mechanical, thermal, and electrical characterization for packaging advancements.
Benefits
- Competitive pay and benefits designed to help you and your family live your best life.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Career Level
Intern
Education Level
No Education Listed
