Packaging Engineering Intern
About The Position
Qorvo's Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full-time opportunities, as available. Qorvo's Internship Program offers: Challenging, skill-building assignments, Mentoring and coaching from industry experts, Launch & Learns and other learning opportunities, Collaborative team-based work environment, Networking and social events, Final presentation to business leaders. Qorvo’s Packaging Engineering Internships are offered in our Global Operations business group. Specific projects and responsibilities will be determined based on the business needs at the time of the internship assignment.
Requirements
- BS in Mechanical, Chemical, Electrical Engineering
- Communication and presentation skills
- Ability to manage and drive problem resolution
- Demonstrate strong analytical thinking skills
- Able to work autonomously
Responsibilities
- Gain knowledge on Back Grinding, Dicing, and DTR Processes to assist with R&D and continuous improvement initiatives.
- Contribute to the advancement of the DTR image analysis with a programming initiative.
- Characterize the small R&D products and processes (tooling, films, DTR pocket tapes, etc.) using solid modeling and laser metrology to enhance the process.
- Onsite hands-on learning of semiconductor assembly processes
- Other minor activities related to documentation and continuous improvement (A3s and Lean)
Benefits
- Competitive hourly pay commensurate with experience: $31/hr - $42/hr (subject to change dependent on physical location)
- Total Rewards package
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Career Level
Intern
