Packaging Engineer

Texas Instruments • Dallas, TX

1d

About The Position

As a member of the packaging team, the Packaging Engineer will interact with multiple product groups and functions and have visibility on projects, with opportunities for growth within the team and across the Package Technology Solutions organization. The role focuses on packaging materials and package technologies for power devices, particularly for datacenter and automotive applications. It includes developing and qualifying package designs and capabilities, making design tradeoffs, supporting production process introductions, and preparing or updating specifications for integrated-circuit piece parts or semiconductor assemblies.

Requirements

• Bachelor's degree in Electrical Engineering, Materials Engineering, Mechanical Engineering, or a related engineering field.
• At least 5 years of experience working as an engineer on projects with substantial packaging activities.

Nice To Haves

• Ability to perform packaging tradeoffs among system performance, package design, cost, manufacturability, and reliability.
• Ability to design packages with an emphasis on power efficiency.
• Understanding of inductor design and manufacturing.
• Ability to work with assembly sites to ramp new processes.
• Understanding of manufacturing impacts on quality.
• Understanding of best practices for ensuring supplier quality.

Responsibilities

• Develop and enhance substrates, mold compound, and other packaging materials for power devices, focusing on datacenter and automotive applications.
• Collaborate with product lines, AT sites, and suppliers to define package requirements and roadmaps for power devices.
• Co-design and qualify new power packages and capabilities with product groups.
• Evaluate tradeoffs among system performance, package design, cost, manufacturability, and reliability.
• Use thermal and mechanical modeling to inform package technology selection and design tradeoffs.
• Coordinate introduction of new package processes into production at internal and external AT sites.
• Prepare and/or update specifications for piece parts of integrated circuits or semiconductor assemblies.
• Work with the failure analysis team to improve designs and processes.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level