Packaging Design Engineer

Advanced Micro Devices, Inc•Austin, TX

About The Position

AMD is seeking a Package Design Engineer to support execution of complex package designs. The role calls for a self-driven technical expert who can deliver high-quality designs quickly and precisely in a fast-paced, dynamic, high-pressure environment. The engineer will help advance AMD’s packaging methodologies through AI-driven design techniques, automation, and next-generation workflows addressing the growing complexity of heterogeneous integration and advanced packaging architectures. The successful candidate will own work across multiple programs, execute with minimal supervision, and collaborate with cross-functional teams. The position involves developing package designs for advanced architectures, coordinating with internal engineering teams and external partners, contributing to design reviews and tapeout, and improving design methodologies and workflows. A bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or a related field is required.

Requirements

Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or a related field.
Ability to take ownership and accountability across multiple programs.
Ability to execute with minimal supervision and manage competing priorities in a fast-paced, high-pressure environment.
Strong collaboration and communication skills.
Solid understanding of Signal Integrity and Power Integrity fundamentals.

Nice To Haves

Experience designing complex substrates, silicon bridges, or interposers.
Experience with advanced packaging technologies.
Hands-on experience with EDA tools.
Experience working with OSATs, foundries, and substrate vendors.
Ability to apply AI/ML and automation to improve design productivity and quality.

Responsibilities

Perform end-to-end package design execution for complex products, meeting performance, cost, quality, and schedule targets.
Handle multiple concurrent design programs in a fast-paced, high-pressure environment.
Develop substrate layouts, bump maps, and interposer designs for advanced packaging, including 2.5D/3D and chiplet-based architectures.
Drive design decisions in collaboration with Signal Integrity/Power Integrity (SI/PI), mechanical, and SoC teams.
Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions.
Communicate design status, risks, and mitigation strategies to stakeholders.
Contribute to design reviews, signoff readiness, and tapeout processes.
Define and enhance package design methodologies, flows, and best practices.
Improve layout efficiency, design reuse, and standardization.