Hiring a talent in advanced packaging design with intensive hands-on experience in GDSII-based physical layout and in-depth knowledge in advanced 2.5D/3D packaging architect and technology. Skills in .mcm-based layout is a plus. The job scope includes: (1) Architect advanced packaging solution to meet future product requirements (2) Define design rules for the new technology (3) Design (with physical layout) test vehicles to support technology development (4) Generation of design collaterals for new technology introduction (5) Drive design-for-yield and design-for-cost activities after a new technology is in production
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees