Nexperia USA Inc. is seeking a Package Architect in Richardson, TX. This role requires expertise in semiconductor packaging and assembly, with a focus on formulating package strategy and roadmaps, particularly for the Product Group “Low Power Distribution & Protection (MAG R04)”. The Package Architect will act as a recognized leader and expert in packaging within the site and/or Business Group (BG), responsible for the functionality and performance of package designs. Key contributions will be made to innovation and optimization projects, with a focus on packaging. The role involves building and broadening competencies, influencing BG-level direction, advising internal and external customers, and analyzing technology and application trends to derive innovative solutions. Additionally, the Package Architect will lead cross-functional teams for NPI-package related projects and generate new design concepts and patent ideas.
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Job Type
Full-time
Career Level
Senior