Nexperia USA Inc. is seeking a Package Architect in Richardson, TX. This role requires an individual to be a subject matter expert in semiconductor packaging and assembly, formulating package strategy and roadmaps, particularly for the Product Group “Low Power Distribution & Protection (MAG R04)”. The Package Architect will act as a recognized leader and expert in packaging within the site and/or Business Group (BG), responsible for the functionality and performance of package designs. Key contributions will be made to innovation and optimization projects focused on packaging. The role involves building and broadening personal competencies, influencing BG-level direction, advising internal and external customers, and analyzing technology and application trends to derive innovative solutions. Additionally, the Package Architect will lead cross-functional teams for NPI-package related projects and generate new design concepts and patent ideas.
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Job Type
Full-time
Career Level
Senior