Optomechanical Engineer, Semiconductor Packaging Tools

Fab2 • Austin, TX

10d

About The Position

As an Optomechanical Engineer at fab2, you’ll work with a full-stack team to develop the complete set of tools and processes for fabricating semiconductor packaging devices. We are seeking a hands-on engineer with deep expertise in designing laser-based systems and a passion for exploring new technologies. This person will play a critical role in developing hardware and optimizing processes that create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating novel methods into semiconductor packaging processes.

Requirements

• Hands-on experience designing, building, integrating, or fundamentally modifying process equipment or scientific instruments
• Experience with optomechanical system design and integration, including mechanical design, optics, precision assembly, wiring, controls, alignment, and system debug
• Experience developing laser micromachining processes and working with vision-based alignment systems
• Proficiency in metrology and failure analysis, including developing custom tools or methods to quantify process performance and improvement
• Ability to work independently in a fast-moving R&D environment and take ownership from initial concept through functional hardware and validated process results

Nice To Haves

• Experience with metal plating
• Exposure to advanced semiconductor packaging technologies, including interposers, through-vias, redistribution layers (RDL), hybrid bonding, thermocompression bonding, flip chip, and underfill
• Experience with ultrafast laser micromachining

Responsibilities

• Own optomechanical system development from concept through operation, including mechanical design, optical layout, precision assembly, wiring, controls integration, alignment, and debug.
• Develop laser micromachining processes and equipment, including vision-based alignment and inspection systems.
• Create and validate novel IC packaging processes, from early experiments through repeatable multi-step process flows.
• Plan and execute experiments across deposition, etch, lithography, bonding, die attach, and related packaging processes.
• Collaborate closely with process, mechanical, electrical, controls, and software engineers to move quickly from concept to working hardware.
• Create and maintain design documentation, experiment records, operating procedures, and equipment maintenance requirements for safe, reliable, and repeatable operation.

Benefits

• Medical, Dental, and Vision insurance
• Generous Paid Time Off inclusive of Holidays and Sick Time
• Visa Sponsorship
• Life and Disability Insurance
• Paid Parental Leave
• 401(k) retirement plan
• Weekly Learning & Development opportunities
• Commuter Benefits including Parking and Late Night Uber rides from the office
• Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrints

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: No Education Listed