The Operator performs wafer fabrication within an assigned functional area, including processes such as photo resist application, bake, align, expose, develop and inspect, oxide and metal etching, and wafer cleaning, following specifications. The role may include production work in Photo, Etch, Thin Films, Metal Deposition, Diffusion, Epi, LPCVD, and associated support areas. The position is on B shift: Sunday, Monday, Tuesday, and every other Wednesday, from 5:50 p.m. to 6:00 a.m. Pay is $19.00 per hour plus a 14% shift differential, for a stated total hourly rate of $21.66, with overtime and an annual incentive program. Grade progression may include training in equipment setup for lower-level operators and certification in a specified number of functional areas. Work is performed in a cleanroom and involves prolonged standing and walking, wearing cleanroom attire, and exposure to hazardous chemicals and oven temperatures of 550–800°C. Employees must be able to perform the physical requirements throughout 12-hour shifts. Sponsorship is not available for this position now or in the future.
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Job Type
Full-time
Education Level
High school or GED