NPI Engineer - ATC

TTM Technologies•Chippewa Falls, WI

About The Position

The NPI Engineer is responsible for successfully launching new products at TTM’s Chippewa Falls ATC site. The role oversees NPI builds and serves as a process resource before product release and while products are being processed on the production floor. The engineer works with Operations, Sales, Field Application Engineering (FEE), Process Engineering, Quality Engineering, vendors, and customers to identify manufacturability risks and coordinate actions that support production timing, quality, and cost targets. The position evaluates customer designs and stack-ups, supports testing and reliability validation, develops processes using new materials, and helps resolve technical issues, process holds, nonconformance reports, and yield concerns. It also drives technical and production readiness reviews before volume production, manages products through development and ramp-up, and maintains project plans and timelines. The engineer contributes to the CF-ATC technology roadmap, communicates manufacturing capabilities and risks to customers and internal leaders, and proposes product differentiation and design changes that can improve profitability, cost, quality, or lead time. The role requires broad knowledge of IC substrate and PCB manufacturing, project management, and the ability to communicate technical topics to customers and non-specialists. The position must comply with TTM export control policies and applicable laws, including ITAR, EAR, and OFAC requirements.

Requirements

Solid knowledge of the complete IC Substrate/PCB manufacturing process, including process flows, production and processing steps, and required tooling.
Strong negotiation skills and ability to drive indirect reports toward project goals.
Strong project management skills, including the ability to break down complex projects into clear action plans.
Ability to communicate technical concepts and issues to people outside the PCB industry and verify understanding.
Awareness of material attributes and processing concerns, with the ability to communicate about them with customers.
Strong written and oral communication skills for working with customer design teams.
Self-motivated and able to work with minimal supervision.
Must comply with TTM Export Control Policies and Procedures and applicable laws, including ITAR, EAR, and OFAC.

Nice To Haves

Bachelor’s degree in Mechanical Engineering, Industrial Engineering, or a related discipline.
10 or more years of experience in engineering and production activities related to the IC Substrate/PCB industry.
Thorough understanding of TTM-ATC manufacturing capabilities and technologies.
Intermediate-level drawing and blueprint interpretation skills.
Experience in more than one functional production area.
Proficiency with Microsoft Office Suite.

Responsibilities

Coordinate with Operations, Sales, FEE, and Process Engineering to identify manufacturability barriers and actions that protect production timing, quality, and cost targets.
Work with material vendors and drive experimentation to develop processes using new materials.
Identify potential cost concerns and communicate them to the Quote Team.
Participate actively in DFM meetings and identify or recommend improvements to processing concerns and product risks.
Support site Processing Engineering with technical issues and process holds.
Support Process Engineering and Quality Engineering with NCRs and yield solutions.
Support customer calls as needed.
Lead technical and production readiness reviews before volume production release.
Drive ATC capability development in line with the technology roadmap.
Monitor and manage new products through ideation, design, development, and production ramp-up.
Create project action plans and use appropriate software to track timelines and assignments against customer expectations.
Provide customer-focused input on the CF-ATC Technology Roadmap and process capabilities to the ATC Director of Operations and Substrate Director of Engineering.
Create technical presentations for higher organizational levels when needed regarding Substrate or Substrate-like PCB manufacturing.
Identify gaps between project performance and desired results and work with involved parties toward resolution.
Work with the site FEE team to evaluate high-risk customer designs and stack-ups, coordinate reliability testing, and provide customers with proposed risk-mitigation solutions.
Develop and maintain positive working relationships with TTM Field Application Engineers and customers’ technical contacts.
Support profitability through product differentiation proposals based on IC Substrate/PCB knowledge, ATC capabilities, and customer needs.
Analyze customer designs for manufacturability and propose changes to improve cost, quality, or lead time.
Maintain knowledge of current industry technologies relevant to TTM-ATC production strengths.
Comply with TTM export-control policies and applicable ITAR, EAR, and OFAC requirements, including identifying controlled products, recognizing foreign visitors, following visitor authorization procedures, understanding export requirements for shipments, and managing vendor approvals for ITAR manufacturing and services.