MTS, EDG System Architecture

Micron Technology•San Jose, CA
•$171,000 - $374,000

About The Position

As a MTS System Architect within Micron Technology's Edge Devices Group (EDG), you will provide system-level technical leadership for the architecture, development, integration, validation, and qualification of UFS, client SSD, and automotive SSD products. You will collaborate with teams across NAND, controller/ASIC, firmware, packaging, hardware, validation, reliability, manufacturing, marketing, and customer-facing functions to deliver robust, high-performance storage solutions. The role involves translating product, customer, and platform needs into system architecture and technical direction; evaluating system-level design tradeoffs; leading technical analysis and cross-functional problem solving; and applying data-driven engineering methods, including AI tools. You will also provide technical mentorship, communicate risks and recommendations to engineering and product leadership, and advance architectural innovation and knowledge-sharing across EDG. AI proficiency is a required skill.

Requirements

  • AI proficiency is a must-have skill.

Responsibilities

  • Deliver system architecture and technical direction for UFS, client SSD, and automotive SSD products throughout the product lifecycle.
  • Translate product, customer, and platform requirements into system-level architecture, technical requirements, development constraints, and validation criteria.
  • Define and evaluate tradeoffs involving NAND, controller/ASIC, package, PCB, host interfaces, power, performance, thermal characteristics, and reliability.
  • Lead technical analysis and build mentorship, using AI tools, for high-speed interfaces, signal and power integrity, power delivery, low-power operation, and platform integration.
  • Evaluate NAND, controller, and firmware interactions and their effects on performance, power, endurance, reliability, error recovery, and qualification.
  • Define and review system power requirements, characterization methodologies, qualification strategies, mission profiles, reliability requirements, and system-level test coverage.
  • Lead cross-functional root-cause analysis and resolution of complex hardware, firmware, NAND, interface, power, performance, reliability, and system-integration issues.
  • Assess architecture, component, and build changes for impacts to performance, reliability, compatibility, manufacturability, qualification, cost, and schedule.
  • Apply data-driven engineering analysis using AI tools to characterization, validation, reliability, power, performance, and manufacturing data to support technical decisions and risk mitigation.
  • Review and provide technical mentorship on schematics, PCB builds, component specifications, electrical requirements, characterization results, and qualification evidence.
  • Serve as a technical subject-matter guide and cross-functional leader, communicating technical risks, tradeoffs, recommendations, and product readiness to engineering leadership and product teams.
  • Drive architectural innovation, technical documentation, build methodologies, training, and knowledge transfer across EDG.

Benefits

  • Choice of medical, dental, and vision plans.
  • Benefit programs that help protect income in the event of illness or injury.
  • Paid family leave.
  • Paid time-off program.
  • Paid holidays.
  • Additional compensation may include bonuses and equity.
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