MTS Packaging Engineer

Advanced Micro Devices, Inc•Austin, TX

11h•Onsite

About The Position

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.

Requirements

Master’s degree or foreign equivalent in Mechanical Engineering, Computer Engineering, Electrical Engineering, or related field.
Flip Chip Packaging
Operational experience in bumping process, substrate manufacturing, Assembly manufacturing, and lid and stiffener manufacturing process
Development work leading to volume production in Semiconductor manufacturing
JMP and minitab tools
Failure analysis
Package reliability
Industry standard (ESD, Jedec, Automotive)

Responsibilities

Evaluate materials and components and processes for use in advanced semiconductor products that must meet specialized design and performance specifications in high volume semiconductor manufacturing.
Drive for supplier engagement on continuous improvement and new capabilities ahead of need.
Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders.
Drive external manufacturer on issue resolution and issue prevention.
Plan and execute change management from internal or external parties.
Involved in regional supplier management – drive to meet Key Performance Indices.
Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio.
Prepare and present Executive Summary of projects and supplier’s performance.
Coordination of activities within/external team to deliver critical metrics.
Develop packaging technology to support performance in high-speed interfaces along with high thermo-mechanical, quality and reliability requirements, including bumping/CPI, package, substrate and assembly.
Manage product, components, and materials from conceptual phase to high volume manufacturing on various aspects of packaging work with package and board level (system level) signal integrity (SI) simulation using multiple high-speed interfaces.
Enhance package and board level performance with SI simulation tools, and integrate SI/PI guidelines and requirements.
Define package technology from conceptual phase with tradeoffs between product electrical performance (SI/PI), cost quality, reliability and manufacturability.
Work on package reliability (1st and 2nd level interconnect) requirements, manufacturability, failure analysis and thermal/mechanical stress interactions.
Utilize knowledge of Flip Chip Packaging (bumping process, substrate manufacturing, Assembly manufacturing, lid & stiffener manufacturing process).