Module Process Engineer IV - (E4) – Plasma Etch

Applied MaterialsBoise, ID
Onsite

About The Position

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

Requirements

  • BS in Engineering, Physics, or Chemistry (or equivalent).
  • 7+ years of experience in plasma etch process engineering.
  • Strong Wafer Fab and semiconductor equipment experience.
  • Proven technical expertise in plasma etch unit processes and Wafer Fab operations.
  • Demonstrated ability to communicate complex ideas, anticipate objections, and persuade senior stakeholders.
  • Ability to travel domestically as assigned <50% per month depending on customer project support.

Nice To Haves

  • In‑depth knowledge of hardware and processes across one or more plasma etch areas; experience with two or more technologies strongly preferred.
  • Domain knowledge of four or more processes spanning two or more technologies.
  • Broad understanding of adjacent disciplines with advanced integration knowledge considered a strong plus.

Responsibilities

  • Lead technical discussions with customers to understand High Value Problems (HVPs) and define, propose, and implement Continuous Improvement Projects (CIPs).
  • Capture and institutionalize learnings to maximize service opportunities and deliver measurable improvements to customer KPIs.
  • Increase Customer Service Agreement (CSA) value through defect reduction, variability reduction, cost‑of‑ownership (COO) improvement, preventive maintenance optimization, process Cpk improvement, tool matching, and output optimization.
  • Identify and drive opportunities for CSA renewal, upsell, and penetration.
  • Demonstrate and lead adoption of new service technologies, including FabVantage offerings, through customer demos, on‑site evaluations, and Joint Development Programs (JDPs).
  • Resolve complex equipment and process issues using advanced analytics, equipment and process expertise, and systematic troubleshooting methodologies to perform effective root cause diagnosis.
  • Generate comprehensive technical reports and present findings to customers, including prioritization and recommendations based on analysis of Bill of Materials (BOM), Equipment Constants (EC), tool sensor data, on‑wafer results, and benchmarking across products.
  • Serve as a technical authority in plasma etch, providing guidance on integration, yield, and manufacturability challenges.
  • Mentor and lead junior‑level MPEs, providing technical direction, coaching, and knowledge transfer.

Benefits

  • Supportive work culture that encourages you to learn, develop, and grow your career
  • Programs and support that encourage personal and professional growth
  • Comprehensive benefits package
  • Eligibility for other forms of compensation such as participation in a bonus and a stock award program, as applicable.
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