Module Excellence Principal Engineer (Mult. Pos.) - Job# 6862

TSMC•Phoenix, AZ

7h•Onsite

About The Position

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. As a Module Excellence Principal Engineer, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Multiple positions available.

Requirements

Master’s degree or foreign equivalent in Computer Science, Industrial Engineering, Manufacturing Management, Information Systems Management or a related field and 5 years of engineering experience.
2 years of semiconductor manufacturing experience in advanced technology nodes between 3nm to 5nm.
3 years of experience in at least 3 of following manufacturing management system or indexes: Enterprise Management Platform (EMP), Statistical Process Control (SPC), Failure Detection Control (FDC), Tool Automation Protocol (TAP), Engineering Workflow automation (WFA), or Manufacturing Executive System (MES).
3 years of experience in all the following programming skills: Python, SQL, PowerBI, and VBA.
2 years of experience automating workflows to increase operational efficiency.
2 years of experience managing engineering teams.
Willing and able to work on-site at our Phoenix Arizona facility.

Responsibilities

Use programming and analysis skills to sustain the semiconductor engineer systems automation in advanced technology from 3nm to 5nm, including maintaining systems settings and troubleshooting to solve daily system issues.
Assist users with necessary requirements design, such as production line defect handling workflow automations, Out of Control Action handling workflow automations, and other related 45 workflows automation in Lithography, Etching, Thin-film and Diffusion area process steps.
Help users to build up the necessary index for monitoring system performance of usage and success rate by Python, PowerBI, SQL, VBA etc. or other relevant coding language.
Oversee the teams and have the cross-culture views, well communication skills to integrate the team resource and lead the team members to react with the diverse production line issues proactively.
Cooperate with diverse organizations such as different area Module departments, IT departments, CIM (Computer Integration Manufacturing) and others supporting organizations such as Facility or Logistics to coordinate the systematic solutions to resolve the production line needs.