Module Engineering - Day Shift 5 or 7

Intel Corporation•Chandler, AZ

5d•$85,200 - $162,500•Onsite

About The Position

Join Intel's Foundry Technology Manufacturing business unit and play a key role in shaping the future of semiconductor packaging. As a Module Engineer, you will develop and optimize assembly processes and equipment, applying innovative concepts to enable Intel's next-generation foundry packaging platform technologies. You will work at the intersection of engineering, manufacturing, and technology development to deliver world-class packaging solutions for our foundry customers.

Requirements

US Citizenship required.
Bachelor's degree with 1+ years of experience in one of the following fields: Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
OR Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or in a STEM related field of study.
6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.

Nice To Haves

Prior experience working in a technology or semiconductor manufacturing environment.
Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context.

Responsibilities

Design and develop assembly processes and equipment, applying novel engineering concepts to advance Intel's foundry packaging roadmap and platform technologies.
Optimize manufacturing efficiency for foundry packages, developing processes that meet rigorous quality, reliability, cost, yield, productivity, and manufacturability requirements specific to foundry customer needs.
Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting innovations and improvements through technical white papers.
Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing.
Ensure physical package designs are manufacturable within foundry process flows, and oversee the full cycle of package manufacturing processes, procedures, and production flows.
Establish material specifications for contract assemblers and raw material vendors, partnering closely with supplier quality and procurement teams to enforce process compliance and vendor performance standards.
Create new reliability screening techniques, acceleration methods, and quality tools to enable early detection of potential packaging quality and reliability risks within the foundry manufacturing environment.
Define reliability requirements aligned to foundry customer needs, and influence design decisions, material selection, and process development based on a fundamental understanding of failure mechanisms.
Lead continuous improvement initiatives using statistical methods and experimental design to innovate, troubleshoot, and enhance equipment and process performance.
Serve as a technical resource for foundry packaging challenges, responding to customer and partner requests and providing consultation on process improvements.
Drive standardization across product qualification frameworks, manufacturing quality systems, and methodologies, while actively engaging with packaging technology development and partner engineering teams to assess process maturity and mitigate risks to key product milestones.