Module Development Engineer

Intel Corporation•Santa Clara, CA

18h•$155,520 - $298,440•Onsite

About The Position

Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and material suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.

Requirements

PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 9+ years of relevant experience
Hands-on experience in dry etch semiconductor manufacturing, including ownership of complex process development and optimization in a foundry or high volume manufacturing environment
Strong command of plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms
Demonstrated record of delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability for advanced technology nodes
Proven ability to lead technical problem solving across projects or sub modules, influencing peers and stakeholders without formal people management responsibility
Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data based decisions
Experience working with and troubleshooting advanced semiconductor manufacturing equipment in a cleanroom environment

Nice To Haves

5+ years of direct experience developing and deploying dry etch processes for advanced logic or foundry technologies, including technology node transitions or major process changes
Experience with advanced dry etch technologies such as: ICP / CCP plasma etch o High aspect ratio etch (HARC) o Atomic Layer Etch (ALE) o Radical and Vapor phase isotropic etching o Ash and surface treatments o EUV patterned layer etch integration
Demonstrated impact on cross module or integration level challenges, such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion
Strong understanding of advanced device architectures (e.g., FinFET, GAA, nanosheet) and their etch integration requirements
Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation
Ability to define technical approaches, de risk options, and guide less senior engineers through complex problem solving
Track record of effective collaboration with integration, lithography, device, yield, and equipment partner teams to deliver robust manufacturing solutions
Evidence of broader technical influence, such as internal technology disclosures, patents, publications, or recognized subject matter expertise within the organization

Responsibilities

Drives technology development and enablement for both high volume manufacturing and future technology.
Provides process integration and equipment solutions.
Performs feasibility studies to meet desired device specifications.
Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap.
Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
Partners with key equipment and material suppliers to develop and implement enabling elements of the technology.
Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.