Module Development Engineer

Intel Corporation•Hillsboro, OR

17h•$133,800 - $255,200•Onsite

About The Position

Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap. Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.

Requirements

PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 6+ months of relevant experience OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 3+ years of relevant experience OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of relevant experience
Hands-on experience in dry etch semiconductor processing within a manufacturing or manufacturing adjacent Research and Development environment
Strong understanding of plasma etch fundamentals, including plasma–surface interactions, selectivity, profile control, and defect mechanisms
Demonstrated experience with process development, optimization, and characterization for advanced semiconductor technologies
Proficiency in statistical data analysis and design of experiments (DOE) using tools such as JMP, Python, or MATLAB
Experience operating, qualifying, and troubleshooting semiconductor manufacturing equipment in a cleanroom environment
Ability to analyze complex process data, identify root causes, and implement data driven corrective actions

Nice To Haves

3+ years of direct experience developing and ramping dry etch processes for advanced technology nodes in a high volume manufacturing or foundry environment
Experience with one or more of the following dry etch technologies: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic layer etch (ALE), EUV patterned layer etch integration
Demonstrated contributions to yield improvement, defect reduction, profile control, or process window expansion at the module or integration level
Working knowledge of advanced device architectures (e.g., FinFET, GAA, nanosheets) and their etch specific challenges
Experience with physical and materials characterization techniques, such as SEM, TEM, CD SEM, AFM, XPS, or ellipsometry
Familiarity with image analysis and automated data processing techniques for metrology and defect inspection
Proven ability to work effectively with cross functional teams (integration, lithography, CMP, device, yield, equipment suppliers) to deliver robust manufacturing solutions
Demonstrated technical leadership within projects, including mentoring junior engineers or influencing technical direction without formal authority

Responsibilities

Drives technology development and enablement for both high volume manufacturing and future technology
Provides process integration and equipment solutions
Performs feasibility studies to meet desired device specifications
Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements
Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures
Develops roadmaps for technologies enabling future roadmap
Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products
Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology
Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods
Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap