Module Development Engineer - LTD Dry Etch

Intel•Hillsboro, OR

3d•$115,110 - $219,550•Hybrid

About The Position

Join Intel Logic Technology Development and help advance the next generation of patterning. You will operate in a high impact space, partnering closely with cross functional teams (Process Integration, Manufacturing, Equipment Engineering, Yield/Defect Engineering, and suppliers) to solve complex technical challenges and establish long term systems that sustain performance. This role requires regular onsite presence to fulfill essential job responsibilities. Drive technology development for future technology and high-volume manufacturing, provide process integration and equipment solutions, and perform feasibility studies to meet desired device specifications. Own and drive development of the next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies. Perform pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and developing roadmaps for technologies enabling future roadmap. Provide technical leadership for cross functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions. Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle. Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems). Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture). Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment. Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders. Recommend and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products. Partner with key equipment and material suppliers to develop and implement enabling elements of the technology. Perform process technology feasibility studies through theoretical simulations and/or practical engineering methods.

Requirements

PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with relevant industry or graduate school research experience.
OR Master's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 2 years of relevant industry or graduate school research experience.
OR Bachelor's degree in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor related STEM field with 4+ years of industry experience at a leading foundry or dry etch equipment supplier.
Hands-on experience in dry etch semiconductor manufacturing, including ownership of process development and optimization.
Experience with plasma etch fundamentals, including plasma generation, plasma-surface interactions, selectivity, profile control, and defect mechanisms.
Experience delivering dry etch process solutions that improved yield, reliability, performance, or manufacturability.
Expertise in statistical analysis and DOE methodologies, using tools such as JMP, Python, or MATLAB to drive data-based decisions.

Nice To Haves

4+ years of direct industry experience developing and deploying dry etch processes for advanced logic, foundry technologies or dry etch equipment suppliers.
Experience with advanced dry etch technologies such as: ICP / CCP plasma etch, High aspect ratio etch (HARC), Atomic Layer Etch (ALE), Radical and Vapor phase isotropic etching, Ash and surface treatments, EUV patterned layer etch integration.
Experience in managing complex process challenges and provide solutions such as pattern fidelity, CD control, defectivity, variability reduction, or process window expansion.
Experience with materials and device characterization techniques, including SEM, TEM, CD SEM, AFM, XPS, or electrical correlation.
Expertise in APC development and variability reduction in a manufacturing environment.
Expertise in etch driven defect reduction and metrology in a manufacturing environment.
Proven ability to lead technical problem solving across projects, influencing peers and stakeholders without formal people management responsibility.

Responsibilities

Drive technology development for future technology and high-volume manufacturing.
Provide process integration and equipment solutions.
Perform feasibility studies to meet desired device specifications.
Own and drive development of the next generation patterning processes, including process architecture, optimization strategies, and qualification methodologies.
Perform pathfinding activities in support of process and hardware development on existing and first of kind equipment, enabling manufacturing of innovative device architectures and developing roadmaps for technologies enabling future roadmap.
Provide technical leadership for cross functional problem solving to resolve complex process and defect issues; drive structured root cause, containment, and permanent corrective actions.
Design and execute comprehensive characterization plans; plan and conduct experiments (DOE/response surface/robustness studies) across the development cycle.
Establish and mature control systems to optimize and sustain production performance (SPC, control plans, alarms, response plans, recipe governance, sustaining systems).
Develop strategies and infrastructure to resolve difficult problems and implement systems to manage these problems in the future (standard work, monitoring, dashboards/analytics, knowledge capture).
Drive improvements in yield, reliability, cost, productivity, and process capability, ensuring scalable transfer to manufacturing and ongoing sustainment.
Influence technical direction, mentor engineers (as appropriate for grade), and communicate status/risks clearly to stakeholders.
Recommend and implement modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
Partner with key equipment and material suppliers to develop and implement enabling elements of the technology.
Perform process technology feasibility studies through theoretical simulations and/or practical engineering methods.