About The Position

Qualcomm is the world’s largest fabless semiconductor company and a global leader in wireless innovation—powering the majority of 3G, 4G, and 5G devices while pioneering the future 6G era. Our hardware engineering teams build industry‑leading modem and RF transceiver solutions enabling the next generation of wireless technology. We are seeking a highly skilled Modem Hardware Design Engineer to join our advanced design organization, focused on AI‑driven methodologies and next‑generation modem hardware development. This role blends traditional design expertise with cutting‑edge GenAI, ML‑assisted flows, and agentic-AI automation frameworks to accelerate all phases of the project and deliver leading edge solutions across a wide range of portfolio products. As a Wireless Design Engineer, you will define specifications and architecture/micro-architecture, develop RTL, and optimize for area, power, and performance. You will collaborate closely within the hardware team comprising verification, modeling, and physical implementation teams, while also engaging with system, RF, firmware, and software teams to deliver first-time-right silicon.

Requirements

  • Bachelor's degree in Computer Engineering, Computer Science, Electrical Engineering, or related field and 6+ years of Software Engineering, Hardware Engineering, Electrical Engineering, Systems Engineering, or related work experience.
  • Master's degree in Computer Engineering, Computer Science, Electrical Engineering, or related field and 5+ years of Software Engineering, Hardware Engineering, Electrical Engineering, Systems Engineering, or related work experience.
  • PhD in Computer Engineering, Computer Science, Electrical Engineering, or related field and 4+ years of Software Engineering, Hardware Engineering, Electrical Engineering, Systems Engineering, or related work experience.

Nice To Haves

  • BS or MS degree and 5+ years of relevant industry experience
  • Strong expertise in RTL coding and logic design for wireless modem ASICs or custom datapath components for DSP applications
  • Solid understanding of Verilog, SystemVerilog, C/C++, and SystemC
  • Experience with synthesis, industry LINT, clock domain crossing, low power design and verification
  • Background in wireless/wireline modem technology, DSP, or communication systems
  • Knowledge of 4G/5G 3GPP physical layer standards is a strong plus
  • Ultra-deep sub-micron CMOS technology nodes such as 4nm and below
  • Experience with Generative AI, ML, or agentic-AI‑based automation
  • Proficiency with Unix/Linux shell scripting, Python/Perl, Makefiles, XML
  • Excellent communication, collaboration, and critical‑thinking skills

Responsibilities

  • define specifications and architecture/micro-architecture
  • develop RTL
  • optimize for area, power, and performance
  • collaborate closely within the hardware team comprising verification, modeling, and physical implementation teams
  • engaging with system, RF, firmware, and software teams to deliver first-time-right silicon
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