Microwave Technician II- Bonding (2nd Shift)

BAE Systems•Nashua, NH

3d•$41,844 - $66,952•Onsite

About The Position

This position supports our 2nd Shift, offering a 10% pay premium and a 4/10 work week (Monday to Thursday, with Fridays off). The role involves fabricating and/or modifying complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies. This includes wire and ribbon bonding using various manual and automatic bonding machines, or utilizing an MRSI microwave component automated pick and place machine. The technician will also perform substrate attach (duroid/ceramic), MMICs, IC's, caps, diodes, and resistors, along with soldering and eutectic die attach. Experience with lamination presses, bladder bag ovens, and sheet epoxies for attaching substrates to modules/housings is required, as is the ability to work with a wide variety of adhesives and epoxies.

Requirements

High School Diploma or GED. 1 year of work experience or equivalent experience required in lieu of a High School Diploma or GED
Ability to work under a microscope for extended periods of time
Ability to prioritize tasks to meet deadlines
Ability to work independently and in a team

Nice To Haves

Active security clearance
Proficient with Microsoft Office Suite
Microwave technology experience

Responsibilities

Fabricating and/or modifying complex micro-integrated circuit modules or microwave/RF integrated circuit modules and sub-assemblies by following specific instructions, such as for wire and ribbon bonding utilizing various manual and automatic bonding machines or using an MRSI microwave component automated pick and place machine
Performing substrate attach (duroid/ceramic), MMICs, IC's, caps, diodes and resistors
Soldering skills and eutectic die attach
Working with lamination presses, bladder bag ovens and sheet epoxies (mainly with the focus of attaching substrates to modules/housings)
Working with a wide variety of adhesives and epoxy's