Microelectronics Solder Assembler

Spectrum Control•Marlborough, MA

4d•Onsite

About The Position

At Spectrum Control, most departments operate on a 4-day, 10-hour work schedule in exchange for a 3-day weekend. We offer competitive wages and PTO, plus our benefits begin on day 1 of employment. Come join a workforce where we put you first! Job Summary: We are seeking a highly skilled Senior Microelectronics Assembler to join our defense electronics manufacturing team. In this critical role, you will assemble high-reliability RF microelectronic modules using solder mount technology (SMT).

Requirements

High school diploma or equivalent; technical certificate or associate degree preferred.
Minimum 7 years of hands-on experience in microelectronics assembly, specifically in defense or aerospace environments.
Excellent hand-eye coordination and manual dexterity for high-precision work under a microscope, and use of fine motor skills for assembly tasks requiring microscopes and tweezers.
Knowledge and understanding of military and aerospace standards (MIL-STD-883, J-STD-001 Class 3, IPC-A-610/STD-001).
Experience working in Class 1000 or Class 10,000 cleanroom environments.
Certification in IPC J-STD-001 and/or MIL-STD-883 procedures.

Nice To Haves

Self-motivated, reliable, and able to work independently in a fast-paced, secure environment.
U.S. Citizenship to handle ITAR documents
Strong communication skills and ability to follow detailed instructions and process documentation.
Ability to work with engineers to aid in early development prototyping and contribute to process improvement initiatives.
Leadership ability to train and work with other assemblers

Responsibilities

Operate SMT microelectronics equipment: soldering irons, hot plates, vacuum ovens, reflow tools.
Ability to rework components as small as 0201 and various sizes of QFNs and packaged parts with tight pitch.
Comfort using flux and experience and emphasis on post-solder cleaning SMT boards for high quality.
Ability to solder connectors, stripping leads, tinning components and crimping harnesses.
Interpret and work from detailed engineering and production drawings, process travelers, and assembly instructions.
Maintain strict adherence to ESD controls, cleanroom protocols, and workmanship standards (e.g., J-STD-001 Class 3).
Ability to learn advanced BGA solder reflow equipment.
Conduct die attach operations using conductive and non-conductive epoxies or eutectic methods or ability to learn attach methods.
Collaborate with quality engineers and process engineers to troubleshoot issues and improve yields, as well as RF and hardware engineers on early development modules to meet customer needs.
Perform precision assembly of high-reliability microelectronic packages, including hybrid modules & IMA, MCMs, RF SMT boards and chip-and-wire assemblies.
Inspect in-process and final assemblies under high magnification to ensure compliance with military specifications (e.g., MIL-PRF-38534, MIL-STD-883).