Microelectronics Failure Analysis Scientist

The Aerospace Corporation•El Segundo, CA

4d•Onsite

About The Position

The Aerospace Corporation is the trusted partner to the nation’s space programs, solving the hardest problems and providing unmatched technical expertise. As the operator of a federally funded research and development center (FFRDC), we are broadly engaged across all aspects of space— delivering innovative solutions that span satellite, launch, ground, and cyber systems for defense, civil and commercial customers. When you join our team, you’ll be part of a special collection of problem solvers, thought leaders, and innovators. Join us and take your place in space. Job Summary Physical Sciences Laboratories (PSL) supports the effective and timely development and operation of national security systems through scientific research and the application of advanced technologies. PSL has more than 150 specialized laboratories used to test, analyze, and troubleshoot virtually every aspect of rocket and satellite system design, development, construction, deployment, and operation. The expertise of the laboratories’ technical staff allows PSL to stay abreast of new technological developments and program support issues associated with rapidly evolving space systems. The Microelectronics Technology Department (MTD) is part of PSL with specialized laboratories for testing, accelerating, and analyzing, failures in electronics used for space system. MTD is comprised of two sections: one that performs radiation effects testing and discrete microelectronics testing, while the other section performs failure analysis on microelectronics using tools that can identify anomalies from the macroscopic down to the atomic scale.  MTD is looking for a Microelectronics Failure Analysis Scientist (Senior Member of Technical Staff or Research Scientist – Microelectronics / Semiconductor Engineering) to support investigations of physics of failure in silicon CMOS, III-V devices, and other materials and technologies for space applications. Highlights of our lab's capabilities can be seen here: Virtual Tour The selected candidate will be required to work full-time, on-site at our facility in El Segundo CA.

Requirements

Ph.D. degree in electrical engineering, computer engineering, materials science, physics, chemistry or related fields is required
A minimum of (5) years of progressively responsible professional engineering or scientific experience (graduate school research experience may count toward this requirement), demonstrating a proven track record of technical leadership, innovation, and the ability to solve complex technical challenges is required.
Proficient with the operation of dual beam focused ion beam (FIB) scanning electron microscopes (SEM) and energy dispersive spectroscopy (EDS/EDX).
Experience with characterization or fabrication of Si-CMOS and III-V semiconductors
Knowledge of physical analysis and fault isolation techniques such as electron microscopy, thermal imaging, focused ion beam, scanning transmission electron microscopy (S/TEM), or electron beam induced current (EBIC) imaging
Experience with Python/ MATLAB or similar software for data collection/analysis and simulation
Willing to travel domestically up to 10% of the year to customer site/ conferences (as needed)
This position requires the ability to obtain and maintain a security clearance, which is issued by the U.S. government. U.S. citizenship is required to obtain a security clearance
A minimum of (8) years of progressively responsible professional engineering or scientific experience (graduate school research experience may count toward this requirement), demonstrating a proven track record of technical leadership, innovation, and the ability to solve complex technical challenges is required.
Project management experience with demonstrated leadership of projects or programs is required

Nice To Haves

Strong publication record and demonstrated ability to develop and execute innovative research projects, especially those related to microelectronics, is preferred
Proficiency with FIB-Time of Flight Secondary Ion Mass Spectroscopy (FIB-ToF-SIMS)
Hands-on expertise in scanning transmission electron microscopy (STEM) and related techniques including diffractive 4D-STEM and EELS
Advanced skills in electron beam backscattered diffraction (EBSD), transmission Kikuchi diffraction (TKD), SEM electron beam induced current (EBIC), STEM-EBIC, and related fault isolation techniques
Working knowledge of cryogenic SEM-related techniques and cathodoluminescence
Demonstrated capability with automated FIB operations including TEM sample preparation, serial cross-sectioning, 3D EBSD, circuit editing, and integrated circuit delayering
Familiarity with e-beam lithography
Background in Li-ion battery materials, including sample preparation and microscopy/mass spectroscopy characterization
Technical knowledge of semiconductor integrated circuit layout and design, including PDK, DRC, DFM, VLSI architecture, BEOL technologies, and 3D/advanced chip packaging techniques is highly desired
Programming skills in VHDL/Verilog/FPGA/microprocessor environments
An active TS/SCI  clearance, which is issued by the U.S. government, is strongly preferred. U.S. citizenship is required to obtain a security clearance

Responsibilities

Provide technical support to national security space programs, internal, and academic collaborators
Conduct research on microelectronic device technologies for application in space systems, including developing new physical analysis techniques and developing knowledge of hardware security verification
Perform failure analysis and anomaly resolution investigations of integrated circuits and other microelectronic devices using physical analysis techniques such as scanning electron microscopy, focused ion beam, electron beam induced current imaging, laser scanning microscopy, atomic force microscopy, or transmission electron microscopy
Present results of assessments/research internally, to customers, at scientific meetings, and publish research in peer-reviewed scientific journals
Support the adoption and assessment of new technologies and applications, space systems, including technology qualification and assurance
Innovation, velocity, and accountability will primarily be used to assess job performance
Develop capabilities in circuit & device modeling and materials physics simulation

Benefits

Comprehensive health care and wellness plans
Paid holidays, sick time, and vacation
Standard and alternate work schedules, including telework options
401(k) Plan — Employees receive a total company-paid benefit of 8%, 10%, or 12% of eligible compensation based on years of service and matching contributions; employees are immediately eligible and vested in the plan upon hire
Flexible spending accounts
Variable pay program for exceptional contributions
Relocation assistance
Professional growth and development programs to help advance your career
Education assistance programs
An inclusive work environment built on teamwork, flexibility, and respect