Microelectronics Failure Analysis Scientist

The Aerospace Corporation•El Segundo, CA

2d•Onsite

About The Position

The Aerospace Corporation, operator of a federally funded research and development center (FFRDC), is seeking a Microelectronics Failure Analysis Scientist (Senior Member of Technical Staff) to join the Physical Sciences Laboratories (PSL), specifically within the Microelectronics Technology Department (MTD). MTD supports national security space programs by testing, accelerating, and analyzing failures in electronics used for space systems. This role involves supporting investigations into the physics of failure in various microelectronic devices and technologies for space applications, utilizing advanced analytical tools to identify anomalies from macroscopic to atomic scales. The position requires full-time, on-site work in El Segundo, CA.

Requirements

Master's degree in electrical engineering, computer engineering, materials science, physics, chemistry or related fields.
A minimum of (2) years of progressively responsible professional engineering experience, demonstrating a proven track record of technical leadership, innovation, and the ability to solve complex technical challenges.
Proficient with the operation of dual beam focused ion beam (FIB) scanning electron microscopes (SEM) and energy dispersive spectroscopy (EDS/EDX).
Experience with characterization or fabrication of Si-CMOS and III-V semiconductors.
Knowledge of physical analysis and fault isolation techniques such as electron microscopy, thermal imaging, focused ion beam, scanning transmission electron microscopy (S/TEM), or electron beam induced current (EBIC) imaging.
Experience with Python/ MATLAB or similar software for data collection/analysis and simulation.
Willing to travel domestically up to 10% of the year to customer site/ conferences (as needed).
Ability to obtain and maintain a security clearance.
U.S. citizenship is required to obtain a security clearance.

Nice To Haves

Strong publication record and demonstrated ability to develop and execute innovative research projects, especially those related to microelectronics.
Proficiency with FIB-Time of Flight Secondary Ion Mass Spectroscopy (FIB-ToF-SIMS).
Hands-on expertise in scanning transmission electron microscopy (STEM) and related techniques including diffractive 4D-STEM and EELS.
Advanced skills in electron beam backscattered diffraction (EBSD), transmission Kikuchi diffraction (TKD), SEM electron beam induced current (EBIC), STEM-EBIC, and related fault isolation techniques.
Working knowledge of cryogenic SEM-related techniques and cathodoluminescence.
Demonstrated capability with automated FIB operations including TEM sample preparation, serial cross-sectioning, 3D EBSD, circuit editing, and integrated circuit delayering.
Familiarity with e-beam lithography.
Background in Li-ion battery materials, including sample preparation and microscopy/mass spectroscopy characterization.
Technical knowledge of semiconductor integrated circuit layout and design, including PDK, DRC, DFM, VLSI architecture, BEOL technologies, and 3D/advanced chip packaging techniques.
Programming skills in VHDL/Verilog/FPGA/microprocessor environments.
An active TS/SCI clearance.

Responsibilities

Provide technical support to national security space programs, internal, and academic collaborators.
Conduct research on microelectronic device technologies for application in space systems, including developing new physical analysis techniques and developing knowledge of hardware security verification.
Perform failure analysis and anomaly resolution investigations of integrated circuits and other microelectronic devices using physical analysis techniques such as scanning electron microscopy, focused ion beam, electron beam induced current imaging, laser scanning microscopy, atomic force microscopy, or transmission electron microscopy.
Present results of assessments/research internally, to customers, at scientific meetings, and publish research in peer-reviewed scientific journals.
Support the adoption and assessment of new technologies and applications, space systems, including technology qualification and assurance.
Develop capabilities in circuit & device modeling and materials physics simulation.

Benefits

Comprehensive health care and wellness plans
Paid holidays, sick time, and vacation
Standard and alternate work schedules, including telework options
401(k) Plan — Employees receive a total company-paid benefit of 8%, 10%, or 12% of eligible compensation based on years of service and matching contributions; employees are immediately eligible and vested in the plan upon hire
Flexible spending accounts
Variable pay program for exceptional contributions
Relocation assistance
Professional growth and development programs to help advance your career
Education assistance programs
An inclusive work environment built on teamwork, flexibility, and respect