Micro Assembly Process Engineer
About The Position
The Micro Assembly Process Engineer will lead troubleshooting and repair of complex probe cards and sub-assemblies. This role involves supporting Manufacturing Engineering activities by identifying and implementing improvement opportunities, pioneering new ideas, and finding innovative methods to achieve production goals. The engineer will also coach and train technicians, perform operator core trainer training, and participate in tests and experiments to enhance production processes or develop new ones. Responsibilities include supporting modifications of automated assembly systems, alignment measurement parameters, and creating/modifying procedures for new products. The role also entails supporting first article probe cards, managing and participating in assembly equipment upgrades, and contributing to capacity increases to meet demand.
Requirements
- Bachelor’s degree or foreign equivalent in Manufacturing Engineering, Mechanical Engineering or related field.
- 5 years of progressive experience as Field Service/Application Engineer, Quality Control Engineer, or related occupation.
- At least 1 year of work experience in managing medium-to-complex analysis models in JMP, including process data, yield analysis, implement quality controls and DOEs using statistical program software.
- At least 1 year of work experience in troubleshooting probe cards issues for all components.
- At least 1 year of work experience in NPI (new product introduction) processes and equipment assessment and customization.
- At least 1 year of work experience in micro assembly process and equipment performance CPI (continuous process improvement) to lead improvement projects.
- At least 1 year of work experience using microscopes, micromanipulators, and metrology tools.
- At least 1 year of work experience troubleshooting and repairing precision electromechanical assemblies using root cause analysis techniques and standard measurement instruments.
- At least 1 year of work experience transferring process from early stage of development to LVM (Low Volume Manufacturing) and HVM (High Volume Manufacturing).
- At least 1 year of work experience in dimensional inspection and alignment verification using metrology tools: optical measurement systems, calipers, micrometers, and dial indicators.
- At least 1 year of work experience establishing HVM processes including documentation, requirements, specifications, and manufacturing work instructions.
Responsibilities
- Lead troubleshooting and repair of complex probe cards and sub-assemblies.
- Perform probe card troubleshooting, repair and maintenance.
- Support Manufacturing Engineering activities by recognizing, prioritizing, and acting on improvement opportunities, pioneering new ideas, and finding innovative methods to accomplish production goals.
- Coach and train technicians to develop teamwork, leadership, and technical skills.
- Perform operator Core trainer training and certification across CWW shifts.
- Participate in tests and experiments to improve production processes or develop new products and processes.
- Support modifications of automated assembly systems process, alignment measurement parameters, as well as create and modify procedures for new products.
- Support first article probe cards including mechanical substrate alignment and sub-assembly, associated new tooling introduction, initial set-up and verification, various metrology steps, and rework if necessary.
- Project manage and participate in assembly equipment hardware and software upgrades based on process quality and throughput objectives.
- Participate in equipment capacity increases, CapEx Projects, and product related tooling capacity increases to ensure FormFactor meets capacity demand.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
