Memory Packaging Engineer

Apple

7d

About The Position

As a Memory Packaging Engineer, you will define, develop, and qualify next-generation memory packages for future Apple products. You will guide memory partners’ package roadmaps and collaborate with internal engineering teams to enable bandwidth and density scaling. You will own work across the product lifecycle, from initial concept through qualification, architecting memory solutions through co-design between memory technology and systems.

Requirements

• Bachelor's degree in a relevant field.
• Strong knowledge of thin-die stacking technologies, including wirebond, flip-chip, and wafer/die bonding.
• Strong knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal challenges.
• Working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.
• Deep understanding of SI/PI co-design with memory die and high-speed DDR or differential signaling.
• Understanding of how memory die floorplan and architecture influence package structure and routing.
• Excellent communication skills for collaborating with internal teams and managing external vendors.

Nice To Haves

• MS or PhD.
• 3+ years of industry experience in package design and assembly process development of high-bandwidth and high-density memory packages.
• Experience collaborating with memory die design teams.

Responsibilities

• Drive the definition, development, and qualification of next-generation memory packages.
• Guide the package roadmaps of memory partners.
• Collaborate with internal engineering teams to enable bandwidth and density scaling.
• Own work across the product lifecycle, from initial concept through qualification.

What This Job Offers

• Job Type: Full-time