About The Position

Join the team at the heart of memory innovation for Apple products. As a Memory Packaging Engineer, you will architect memory solutions that support the performance of Apple hardware, advancing bandwidth density, power efficiency, and system integration through co-design of memory technology and systems. You will drive the definition, development, and qualification of next-generation memory packages for future Apple products. You will guide memory partners' package roadmaps and collaborate with internal engineering teams to enable bandwidth and density scaling. Your ownership will span the product lifecycle, from initial concept through qualification.

Requirements

  • Bachelor of Science degree and 10 or more years of relevant industry experience.

Nice To Haves

  • Master's or PhD preferred, with 10 or more years of industry experience in package design and assembly process development for high-bandwidth and high-density memory packages.
  • Strong knowledge of thin-die stacking technologies, including wirebond, flip-chip, and wafer/die bonding.
  • Strong knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal challenges.
  • Solid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology.
  • Deep understanding of SI/PI co-design with memory die and high-speed DDR or differential signaling.
  • Understanding of how memory die floorplan and architecture influence package structure and routing, with experience collaborating with memory die design teams.
  • Excellent communication skills for collaborating with internal teams and managing external vendors.

Responsibilities

  • Drive the definition, development, and qualification of next-generation memory packages.
  • Guide memory partners' package roadmaps.
  • Collaborate with internal engineering teams to enable bandwidth and density scaling.
  • Own memory packaging work across the product lifecycle, from initial concept through qualification.
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