Member of Technical Staff - Thin Films Engineer

Intel Corporation•Hillsboro, OR

2d•$133,800 - $255,200•Hybrid

About The Position

Intel's Manufacturing Development Customer Engineering (MDCE) organization bridges Technology Development and High-Volume Manufacturing, advancing technology nodes and process capability from product qualification to high-yield production across multiple products and foundry customers. The Member of Technical Staff - Thin Films Engineer joins the MDCE team to drive process innovation across advanced semiconductor technologies in volume manufacturing. The role develops, optimizes, and improves the manufacturability of thin film deposition processes, supporting transitions from early development to high-volume production while meeting foundry customer requirements. It focuses on deposition technologies including CVD, ALD, PVD, epitaxy, thermal/plasma deposition, and may also involve furnace, implant, anneal, and treatment technologies. The engineer works across Technology Development and High-Volume Manufacturing on Intel 18A, Intel 3, 12nm, and next-generation technology nodes. The role provides technical leadership in safety, quality, yield, throughput, cost, defectivity, uniformity, equipment performance, and manufacturing problem resolution. It involves collaboration with internal engineering and business teams, customers, and external suppliers, as well as communicating technical findings to audiences ranging from engineers to executive leadership. The position is based in Hillsboro, Oregon, and is eligible for Intel's hybrid work model, combining time at the assigned site with off-site work.

Requirements

Master's degree in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a STEM-related field.
At least 5 years of semiconductor industry experience focused on thin film deposition processes, or a PhD and at least 3 years of industry experience.
Proven experience in process development, technical leadership, and manufacturing engineering.
Experience working with equipment suppliers such as AMAT, LAM, ASM, and TEL on process optimization.
Comprehensive fab startup experience across manufacturing, quality, R&D, and supply chain functions.
Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
Strong technical problem-solving and analytical skills, including expertise in yield improvement, performance enhancement, and variation reduction.
Understanding of semiconductor manufacturing strategies, fab operations, technology transfer, process development, materials science, and device physics.
Ability to communicate complex technical information to varied audiences and lead cross-functional initiatives.
Ability to manage multiple high-priority projects under pressure, work independently, and navigate ambiguous technical challenges.
Experience with foundry business models and customer engagement requirements.
Ability to interpret industry trends and translate market dynamics into technical strategies.

Nice To Haves

Doctoral degree in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a STEM-related field, with research publications and a patent portfolio in thin film technologies.
Expertise in Gate All Around (GAA) logic technologies within semiconductor foundry environments.
Track record delivering customized solutions across Technology Development and High-Volume Manufacturing organizations.
Cross-functional leadership experience managing diverse stakeholder groups.
Semiconductor foundry experience.

Responsibilities

Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules.
Drive defectivity reduction and uniformity improvements through systematic process enhancement.
Lead technical problem resolution and deliver solutions that meet technology node targets.
Optimize equipment performance in collaboration with internal teams and key suppliers.
Align technical vision with customer requirements and business objectives.
Synthesize complex technical data to formulate and execute strategic responses.
Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines.
Execute innovative solutions rapidly to meet development timelines.
Collaborate with Technology Development, High-Volume Manufacturing, and Business Groups.
Build relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers.
Present technical findings to audiences ranging from engineering teams to executive leadership.
Foster in-person collaboration to accelerate decision-making and problem resolution.
Track semiconductor industry trends and emerging process technologies.
Drive strategic initiatives that advance manufacturing innovation.
Contribute hands-on technical expertise and market insight to technology roadmaps.