Member of Technical Staff - Thin Films Engineer

Intel•Hillsboro, OR

5h•Hybrid

About The Position

Join Intel's Manufacturing Development and Customer Engineering (MDCE) team as a Senior Engineer driving process innovation across advanced semiconductor technologies in volume manufacturing. The role develops, optimizes, and improves the manufacturability of thin film deposition processes, supporting transitions from early development to high-volume production while meeting foundry customer requirements. It operates between Technology Development and High-Volume Manufacturing and supports Intel 18A, Intel 3, 12nm, and next-generation technology nodes. The position leads thin film process excellence across technologies such as CVD, ALD, PVD, epitaxy, thermal/plasma deposition, furnace, implant, anneal, and/or treatment. It involves technical leadership, cross-functional collaboration, equipment optimization, and resolution of manufacturing challenges. This role is eligible for Intel's hybrid work model, splitting time between the assigned site and off-site work. The primary location is Hillsboro, Oregon.

Requirements

Master's degree in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a STEM-related field; alternatively, a PhD with the stated experience is accepted.
At least 5 years of semiconductor industry experience focused on thin film deposition processes, or a PhD and at least 3 years of industry experience.
Proven experience in process development, technical leadership, and manufacturing engineering.
Experience working with equipment suppliers such as AMAT, LAM, ASM, or TEL on process optimization.
Comprehensive fab startup experience across manufacturing, quality, R&D, and supply chain functions.
Proficiency with Statistical Process Control (SPC), Design of Experiments (DOE), and factory automation systems.
Exceptional technical problem-solving abilities and a track record of significant accomplishments across multiple technology nodes.
Strong analytical skills and expertise in yield improvement, performance enhancement, and variation reduction.
Deep understanding of semiconductor manufacturing strategies, fab operations, and technology transfer.
Strong communication skills for presenting complex technical information to varied audiences.
Self-motivation, initiative, and ability to navigate ambiguous technical challenges.
Ability to manage multiple high-priority projects under pressure while maintaining quality focus.
Ability to drive clarity in complex technical situations and lead cross-functional initiatives.
Comprehensive knowledge of process development, materials science, and device physics.
Ability to interpret industry trends and translate market dynamics into technical strategies.
Experience with foundry business models and customer engagement requirements.
Ability to work independently while managing diverse technical assignments.

Nice To Haves

Doctoral degree in Electrical, Mechanical, or Chemical Engineering, Materials Science, or a STEM-related field, with research publications and a patent portfolio in thin film technologies.
Expertise in Gate All Around (GAA) logic technologies in semiconductor foundry environments.
Track record delivering customized solutions across Technology Development and High-Volume Manufacturing organizations.
Cross-functional leadership experience managing diverse stakeholder groups.
Semiconductor foundry experience.

Responsibilities

Champion safety, quality, yield, throughput, and cost optimization across thin film deposition modules.
Drive defectivity reduction and uniformity improvements through systematic process enhancement.
Lead technical problem resolution and deliver solutions that meet technology node targets.
Optimize equipment performance in collaboration with internal teams and key suppliers.
Align technical vision with customer requirements and business objectives.
Synthesize complex technical data to formulate and execute strategic responses.
Own end-to-end resolution of manufacturing challenges spanning multiple engineering disciplines.
Execute innovative solutions rapidly to meet development timelines.
Collaborate with Technology Development, High-Volume Manufacturing, and Business Groups.
Build relationships with Integration, Device, Yield, Quality, Reliability teams, and external suppliers.
Present technical findings to audiences ranging from engineering teams to executive leadership.
Foster in-person collaboration to accelerate decision-making and problem resolution.
Stay current with semiconductor industry trends and emerging process technologies.
Drive strategic initiatives that advance manufacturing innovation.
Contribute hands-on technical expertise and market insight to technology roadmaps.