Mechanical Tooling Engineer

Intel•Chandler, AZ

19h•Onsite

About The Position

The Advanced Packaging Technology and Manufacturing (APTM) organization is responsible for developing and enabling Intel’s next‑generation advanced packaging and test technologies. We deliver both technology development and high-volume manufacturing solutions that power Intel Foundry customers and future product roadmaps. Our mission is to advance Intel’s packaging leadership with predictable execution, world‑class engineering, and innovative tooling solutions that enable breakthrough device architectures. We are seeking a highly motivated Mechanical Tooling Engineer to join our cross‑functional team and contribute to the definition, design, and deployment of tooling and hardware solutions that enable advanced semiconductor packaging.

Requirements

Candidate must possess a master’s degree Mechanical Engineering, Mechatronics, Physics or a related field with at least 4+ years of experience or a PhD in the same fields with 2+ years of experience.
Solid modeling CAD tools such as Pro/Engineer (Creo), SolidWorks, or AutoCAD.
Geometric Dimensioning & Tolerancing (GD&T) and applying it to mechanical component or tooling design.
Mechanical engineering experience in tooling, fixtures, or precision hardware development.

Nice To Haves

Experience in one or more areas: Thermal‑mechanical tooling design, development, verification, and validation
Laboratory experimentation: test setup creation, data collection/analysis, debugging, and validation
Design for Manufacturability (DFM) and process capability improvement
Analytical root‑cause methodologies (5‑Why, Ishikawa, structured debugging)
Tolerance analysis, FEA modeling, pre‑design simulation work
Experience with: MATLAB or similar analytical tools
Basic electrical schematics and hardware troubleshooting
Six Sigma / statistical methodologies (Basic Stat, DOE, reliability statistics)
Program management or RF tooling development (bonus)
Elastomer socket technology, elastomer‑based interfaces, or compliant mechanical interconnect systems.

Responsibilities

Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures and develops roadmaps for technologies enabling future roadmap.
Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.