Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Mechanical/Thermal Engineering Architect position is within the fast-paced DRAM Systems and Component Architecture Group at Micron Technology, Inc. As a core senior technical individual contributor, you will focus on the architecture, build, bring up, validation, and transition to production of systems based on new memory technologies, ASICs, FPGAs, digital, mix-signal, analog circuitry, and power supplies. Solid knowledge and extensive experience in physical and heat-related aspects are required for composing systems based on the mentioned technologies. You should also know high-speed transmission line theory and application, mechanical development, thermal development, and characterization. The position will require hands-on system bring-up, characterization, and debugging, as well as knowledge of laboratory equipment such as thermal chambers, temperature measuring equipment, and mechanical instruments. This is a highly visible and meaningful role, and you will be working very closely with other development groups such as hardware, software, firmware, Media, and ASIC. Designs, defines, and implements complex system requirements for customers and/or prepares studies and analyzes existing systems. Determines system specifications, input/output processes, and working parameters for hardware/software compatibility. Coordinates design of subsystems and integration of total system. Identifies, analyzes, and resolves program support deficiencies. Develops and recommends corrective actions.
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Job Type
Full-time
Career Level
Senior