Mechanical Stress Simulation Staff Engineer

SkyWater Technology Foundry, Inc.•Bloomington, MN

6d•$95,200 - $142,800

About The Position

SkyWater is hiring a Mechanical Stress Simulation Staff Engineer to execute advanced mechanical stress simulations for semiconductor advanced packaging, heterogeneous integration, and BEOL (Back-End-Of-Line) metallization layers. The role uses industry-leading software to model, analyze, and optimize mechanical and thermal behavior in complex semiconductor structures, supporting reliability and performance at device, die, chip, and package levels. The engineer will work with process integration teams to apply simulation results in design and manufacturing workflows, and will document methods, findings, and recommendations aimed at improving reliability and yield.

Requirements

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field, with 3+ years of related experience.
Experience with crack and delamination analysis and BEOL processes and materials.
Proficiency in finite element analysis (FEA) and simulation methodologies.
Hands-on expertise with mechanical simulation tools, including ANSYS, Sentaurus, MultiPhysics Fusion, AutoCAD, and SolidWorks.
Familiarity with semiconductor packaging systems and BEOL materials.
Strong analytical, problem-solving, and communication skills.

Nice To Haves

Prior work in the semiconductor industry, especially in packaging and BEOL.
Knowledge of device performance impacts due to mechanical stress.
Experience with characterization of material properties and shortloop experimental validation.
Semiconductor technology integration experience.

Responsibilities

Develop and execute multi-level mechanical stress models for semiconductor devices, circuits, dies, chips, and packaging.
Simulate elastic, viscoelastic, and crack-related phenomena, including recoverable stress and strain, plastic deformation, delamination, and crack propagation, with consideration of effects on device performance and BEOL reliability.
Use advanced simulation software such as ANSYS, TCAD Sentaurus, SInterconnect, and MultiPhysics Fusion to analyze mechanical stress, heat transfer, and dissipation in semiconductor packaging and BEOL layers.
Plan test structures to characterize material properties, including bulk modulus, shear modulus, coefficient of thermal expansion, and binding strength, for simulation and reproduction of shortloop experiments.
Collaborate with process integration teams to use simulation results in design and manufacturing workflows.
Document methodologies, results, and recommendations for reliability improvements and yield enhancement.

Benefits

Opportunity to participate in incentive plans and other employee financial benefits.
401k match.
Life insurance.
Benefit eligibility starting on day one.
Medical benefits.
Dental benefits.
Mental health benefits.
Vision benefits.
Legal planning.
Short- and long-term disability.
Paid time off.
Paid holidays.
On-site fitness facility.
On-site self-serve market.