Mechanical Stress Simulation Staff Engineer

Skywater • Bloomington, MN

5d

About The Position

SkyWater is hiring a Mechanical Stress Simulation Staff Engineer to execute advanced mechanical stress simulations for semiconductor advanced packaging, heterogeneous integration, and BEOL (Back-End-Of-Line) metallization layers. The role uses industry-leading software tools to model, analyze, and optimize mechanical and thermal behavior in complex semiconductor structures, supporting reliability and performance across device, die, chip, and package levels.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field.
• At least 3 years of related experience.
• Experience with crack and delamination analysis and BEOL processes and materials.
• Proficiency in finite element analysis (FEA) and simulation methodologies.
• Hands-on expertise with mechanical simulation tools, including ANSYS, Sentaurus, MultiPhysics Fusion, AutoCAD, and SolidWorks.
• Familiarity with semiconductor packaging systems and BEOL materials.
• Strong analytical, problem-solving, and communication skills.

Nice To Haves

• Prior semiconductor industry experience, especially in packaging and BEOL.
• Knowledge of device performance impacts caused by mechanical stress.
• Experience characterizing material properties and validating results through shortloop experiments.
• Semiconductor technology integration experience.

Responsibilities

• Develop and execute multi-level mechanical stress models for semiconductor devices, circuits, dies, chips, and packaging.
• Simulate elastic, viscoelastic, and crack-related phenomena, including recoverable stress and strain, plastic deformation, delamination, and crack propagation, with attention to device performance and BEOL reliability.
• Use advanced simulation software to analyze mechanical stress, heat transfer, and dissipation in semiconductor packaging and BEOL layers.
• Plan test structures to characterize material properties needed for simulation and reproduction of shortloop experiments, including bulk modulus, shear modulus, coefficient of thermal expansion, and binding strength.
• Collaborate with process integration teams to apply simulation results in design and manufacturing workflows.
• Document methodologies, results, and recommendations for reliability improvements and yield enhancement.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior