Mechanical Packaging Engineer-Lunar Avionics

KODA Technologies Inc.

About The Position

KODA Technologies is seeking a Mechanical Packaging Engineer to support our customer's lunar avionics program. The engineer will design, document, and release flight avionics enclosures and related hardware, incorporating printed circuit boards (PCBs), interconnects, and associated structural and thermal features. All CAD work is performed exclusively in PTC Creo, and deliverables are peer reviewed prior to release. This requisition covers three experience levels - Junior, Mid-Level, and Senior. Candidates will be evaluated and assigned to the appropriate level based on years of relevant experience, technical depth, and demonstrated ownership. Levels may be filled individually or in combination, depending on program needs.

Requirements

Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or a closely related discipline (equivalent experience considered at Mid and Senior levels).
Minimum 3 years of mechanical packaging / enclosure design experience (Junior); 6+ years (Mid); 13+ years (Senior). Target experience range across the three roles is 3 to 20+ years.
Hands-on proficiency with PTC Creo for parts, assemblies, and drawings.
Working knowledge and application of GD&T per ASME Y14.5.
Demonstrated experience producing peer-reviewed, release-quality mechanical drawings and data packages.
Experience integrating PCBs, connectors, and harnesses into electronics enclosures.
Ability to perform tolerance stack analyses on mechanical assemblies.
Effective written and verbal communication; able to collaborate with multidisciplinary teams (electrical, structural, thermal, manufacturing, quality).
U.S.Citizenship, and the ability to pass a background check

Nice To Haves

Prior experience designing flight avionics enclosures for space, launch vehicle, satellite, missile, or defense applications.
Experience with Model-Based Definition (MBD) workflows and templates in Creo.
Familiarity with aerospace materials and finishes (aluminum alloys, CRES, anodize, alodine/chem film, conversion coatings, plating, thermal interface materials).
Experience with environmental considerations relevant to lunar or space hardware (vacuum, thermal cycling, radiation, vibration, shock, outgassing - NASA-STD-6016 / ASTM E595).
Familiarity with EMI/EMC packaging practices - grounding, bonding, and shielding.
Experience working within a PLM/PDM environment (e.g., Windchill) and configuration-controlled release processes.
Experience designing test fixtures for environmental testing (vibration, thermal-vacuum, shock).
Working knowledge of DFM/DFA principles and interaction with machine shops, sheet-metal fabricators, and additive manufacturing suppliers.
Prior experience supporting Blue Origin or equivalent prime contractor design standards and review processes.
Senior level: demonstrated experience leading mechanical packaging scope through PDR/CDR and mentoring junior engineers.

Responsibilities

Incorporate printed circuit boards and interconnects into mechanical designs for lunar avionic products.
Create 3D CAD models and assemblies, part and assembly drawings, installation drawings, and other required technical documentation for avionic enclosures, applying GD&T (GTOL) and industry drafting best practices.
Collaborate with structural and thermal analysts to incorporate required design features (mounting interfaces, stiffening, thermal conduction paths, fastener patterns, etc.).
Design assembly aids and test fixtures needed to support build and verification activities.
Participate in mechanical design reviews and incorporate review comments into released hardware.
Produce and submit part drawings and models created exclusively in Creo, subject to peer review
Produce and submit assembly drawings created exclusively in Creo, using a Model-Based Definition (MBD) template when requested, subject to peer review.
Produce and submit additional avionics enclosure part or assembly drawings, which may include test and assembly fixtures and Interface Control Drawings (ICDs).
Perform and submit tolerance stack analyses for avionics enclosure assemblies.
Submit technical data required to initiate and inform procurement activities for parts (e.g., drawings, models, BOMs, material and finish callouts).