Mechanical Engineer, Senior Staff

Qualcomm•San Diego, CA
•$169,800 - $254,600

About The Position

Qualcomm Technologies is expanding from silicon leadership into full rack-scale data center systems, including purpose-built rack-level AI inference solutions, data center CPUs, direct-to-chip liquid-cooled racks, PCIe scale-up, Ethernet scale-out, and infrastructure management software. The Senior Staff Engineer will drive thermomechanical system solutions as part of the design team, shaping cooling architectures through thermomechanical design and modelling for systems deployed by customers and ODMs. The role includes thermal and liquid-flow analysis at package, server, rack, and pod levels; external partner engagement; support for development relationships; and full CFD thermal simulations. The engineer is expected to provide practical mechanical engineering judgment and analysis grounded in fabrication techniques, tolerances, failure mechanisms, manufacturability, reliability, and cost. Success includes contributing hands-on to server and rack programs, improving analysis methods across facility interfaces through SoCs, and helping develop and validate scalable liquid-cooling solutions.

Requirements

  • Bachelor’s degree in Mechanical, Thermal, Hardware Engineering, or a closely related engineering discipline.
  • 15 or more years of experience in thermomechanical design.
  • At least 3 years of experience with liquid cooling for high-power-density, high-efficiency coolers, manifolds, and connections.
  • Advanced, expert-level skill in one or more CFD tools.
  • Close working relationships with ODMs and OEMs across the server/rack ecosystem, including joint design (JDM), manufacturing readiness, BOM and supply alignment, and executive-level partner management.
  • A portfolio of shipped products; high-volume products shipped at scale are preferred.

Nice To Haves

  • Experience with OCP rack and server architectures, including ORV3 / Open Rack Wide.
  • Experience with data-center rack-level and system-level thermal design.
  • Experience with AI/accelerator or other high-power-density compute platforms.
  • Familiarity with server and rack mechanical design, manufacturing methods, tolerance analysis, reliability considerations, and design for high-volume production.
  • Experience working directly with ODMs, OEMs, suppliers, and cross-functional engineering teams to develop and validate thermal solutions.
  • Familiarity with PCIe, Ethernet, high-speed connectivity, and other technologies relevant to modern server and rack architectures.
  • Experience with microfluidic cooling technologies.

Responsibilities

  • Support the design team with system thermal and liquid-flow modelling at package, server, rack, and pod levels, providing timely guidance on performance, risk, cost, and feasibility backed by appropriately scoped analysis.
  • Lead external partner engagements for solution development, backstop external analysis with internal analysis, set expectations, and drive successful outcomes.
  • Work with teams to understand thermal power use cases and power envelopes, and provide timely analysis to system engineering to help optimize products.
  • Explore new technologies and intellectual property to ensure designs are world-class and cost-effective, and capture IP critical to the optimized architecture.
  • Support development partner relationships by ensuring information exchanges are sufficient, timely, and complete; participate in design reviews and contribute engineering experience.
  • Conduct full CFD thermal simulations, determine when simulation is appropriate, use effective modelling approaches, delegate when appropriate, contribute at detailed levels, and improve the analysis process flow.
  • Apply practical mechanical engineering best practices, fabrication knowledge, tolerance analysis, and understanding of failure mechanisms to develop realistic solutions.
  • Develop and improve end-to-end cooling and fluid-mechanics analysis methods spanning facility interfaces, pods, racks, servers, and SoCs.
  • Support development and validation of liquid-cooling solutions with ODMs, OEMs, suppliers, and internal engineering teams.
  • Evaluate new cooling technologies and identify opportunities for improved performance, cost, scalability, and intellectual property.

Benefits

  • Competitive annual discretionary bonus program.
  • Opportunity for annual RSU grants, except for employees on sales-incentive plans.
  • Competitive benefits package designed to support employees at work, at home, and at play.
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