We are hiring a Mechanical Engineer – Electronic Packaging & Thermal Analysis to support the design, development, analysis, and validation of advanced electromechanical systems for defense applications. This role focuses on mechanical packaging design, structural and thermal analysis, shock and vibration testing, design for manufacturability (DFM), and rapid research and development prototyping using tools such as Creo and ANSYS in a fast-paced DoD engineering environment.
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Job Type
Full-time
Career Level
Mid Level