As a 2027 Mechanical Engineering Intern, you will join the Electronic Warfare Mechanical Design Hardware Section in Goleta, California, supporting new product development and product enhancements. You will work with more senior team members to design RF systems for challenging thermal and high-vibration environments, with a focus on electronics packaging design. Assignments may include thermal and structural design and analysis; electrical component design, construction, and failure modes; printed wiring board and circuit card assembly processes and best practices; surface-mount and through-hole component installation processes and failure modes; metal fabrication and finishing methods; RF isolation mechanical design; and environmental test methods and equipment. The role is onsite.
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Job Type
Full-time
Career Level
Intern