Manufacturing Technician - Wire Bonding

Microchip Technology Inc.Lowell, MA
Onsite

About The Position

We are seeking a skilled Manufacturing Technician specializing in wire bonding to support semiconductor device fabrication and microelectronics assembly. The ideal candidate brings hands-on experience in precision assembly and artisan-level fabrication processes, with the ability to independently translate product requirements into optimized process setups. Microchip Technology Inc. is a global organization with a strong culture of trust, empowerment, respect, diversity, and communication. We offer opportunities for growth and stability, with a focus on employee development and values-based decision making. Our company is built by dedicated team players who challenge the status quo and empower innovation.

Requirements

  • Trade school or vocational school certification in electronics, manufacturing, or a related field
  • 2–5 years of hands-on experience in semiconductor or microelectronics manufacturing
  • Strong technical aptitude with demonstrated competency in artisan / craftsman processes
  • Ability to work independently ensuring product requirement translation for an optimized process set-up
  • Strong attention to detail and manual dexterity
  • Ability to read schematics and technical documentation
  • Proficient computer skills required to access and interpret engineering drawings, and work instructions
  • Proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3)

Nice To Haves

  • Experience in cleanroom environments
  • Familiarity with high-reliability or aerospace-grade manufacturing standards

Responsibilities

  • Perform component wire bonding for RF transistor packaged devices using automatic and semi-automatic wire bonders; conduct bond pull testing to verify bond integrity
  • Set up, calibrate, and operate multiple wire bonding and test systems concurrently, managing workflow to meet production targets and product specifications
  • Interpret engineering drawings, build sheets, and process documentation to accurately execute manufacturing tasks
  • Execute production work with a high level of precision, maintaining consistent quality and throughput
  • Independently adjust equipment and process parameters, including loop height and bond placement, to optimize performance and product quality
  • Collaborate with test technicians and engineering personnel to refine wire bonding processes and establish optimal operating conditions
  • Perform rework, repair, and modification of assemblies, including solder component removal and replacement
  • Troubleshoot production and equipment issues, documenting and escalating as needed to support timely resolution and continuous process improvement
  • Maintain accurate production records and ensure compliance with quality and manufacturing standards

Benefits

  • Competitive base pay
  • Restricted stock units
  • Quarterly bonus payments
  • Health benefits that begin day one
  • Retirement savings plans
  • Industry leading ESPP program with a 2 year look back feature
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