Manufacturing Engineer IV

Attalon, Inc.•Traverse City, MI

2d•$105,000 - $144,000•Onsite

About The Position

The Manufacturing Engineer will develop, optimize, and maintain manufacturing processes for laser diode devices, with a focus on assembly, interconnect, and packaging technologies. The role supports high-yield, high-reliability production by improving wire bonding, soldering, automation, and equipment performance. The position is based at ATTALON’s vertically integrated manufacturing and R&D campus in Traverse City, Michigan, which specializes in high-performance optical isolators, photodetectors, and laser solutions.

Requirements

Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field.
At least 8 years of experience in semiconductor packaging, photonics assembly, or precision microelectronics manufacturing.
Hands-on experience with wire bonding equipment and process controls.
Experience with high-precision soldering, reflow profiles, and thermal process equipment.
Proficiency with Fineplacer systems or equivalent micro-assembly platforms.
Familiarity with automated assembly systems and process automation methodologies.
Strong data analysis skills using tools such as JMP, Minitab, MATLAB, or Python.
Ability to interpret device performance data, including LIV curves, wavelength, and thermal behavior, and relate it to assembly processes.
Candidates must qualify as a “U.S. Person” under applicable regulations or be eligible for authorization under a U.S. government export license.

Nice To Haves

Master’s degree in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a related field.
Certification in Lean Manufacturing, Six Sigma, or similar process improvement methodologies.
Knowledge of precision assembly and optical alignment.
Previous experience in a low-volume, high-mix manufacturing environment.
Advanced problem-solving and project management skills.
Experience with data acquisition systems, instrumentation, and automated test equipment.

Responsibilities

Develop, qualify, and sustain wire bonding processes for laser diode die attach and packaging, including Au ball bonding and wedge bonding.
Optimize precision soldering processes for die attach, sub-mount attach, and optical subassembly integration.
Operate, program, and maintain Fineplacer systems for high-precision die placement, alignment, and bonding.
Own and optimize process recipes for vacuum soldering systems and thermal processing equipment, including reflow, annealing, cure cycles, and temperature uniformity.
Implement automation solutions to increase consistency, reduce cycle time, and improve process control.
Create manufacturing documentation, including work instructions, standard operating procedures, control plans, and PFMEAs.
Conduct root cause analysis for bonding or soldering defects and implement corrective actions.
Collaborate with R&D to transition new laser diode designs into scalable, production-ready processes.
Monitor SPC data, yields, and critical process parameters to identify improvement opportunities.
Support equipment calibration, maintenance, and capability evaluations.
Work with quality and operations to ensure devices meet electrical, optical, and reliability specifications.