LTD Integration Engineer

Intel Corporation•Hillsboro, OR

22h•Onsite

About The Position

The LTD Integration Engineer is a technical leader responsible for defining and executing advanced-node backend‑of‑line (BEOL) integration strategies within Intel’s leading-edge process technologies. This role delivers sustained, organization‑level impact, shapes technology direction from development through high‑volume manufacturing, and resolves high‑complexity integration challenges spanning devices, interconnect, and advanced packaging enablement. This position requires deep expertise operating at the intersection of Technology Development (TD), Pathfinding, and High‑Volume Manufacturing (HVM) in a logic foundry environment, with demonstrated ownership of critical BEOL process segments and strong cross‑organizational technical leadership. Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Requirements

Extensive experience in Technology Development, Pathfinding, and/or Research & Development for advanced logic technologies.
Proven success in a high‑volume logic foundry environment, with direct ownership of integration deliverables from development through manufacturing ramp.
Demonstrated experience transitioning solutions from TD to HVM, including qualification, yield ramp, and manufacturing stabilization.
Advanced‑node logic integration expertise (e.g., 10nm, 5nm, 3nm, 2nm or equivalent FinFET/nanosheet technologies).
Strong background in BEOL integration, including MIM capacitors, TSV / 3DIC enablement, backend passive devices, and reliability‑critical structures.
Ability to assess complex cross‑flow interactions and make sound engineering trade‑offs at the system and technology level.
Clear technical ownership mindset, with the ability to articulate scope, impact, and results to both technical and executive stakeholders.
Recognized technical leader capable of influencing across organizations, driving alignment, and delivering results in fast‑paced development environments.
Track record of intellectual property generation and technical contributions that shape long‑term technology direction.
MS or PhD in Electrical Engineering
12+ years of experience in advanced node process integration experience
10+ years of experience working across Technology Development (TD), Pathfinding, and High‑Volume Manufacturing (HVM) in a logic foundry environment

Responsibilities

Own and drive an integrated BEOL process segment on advanced logic nodes (FinFET and beyond) during technology development, qualification, and manufacturing ramp, with full accountability for yield, reliability, performance, and manufacturability.
Serve as the single‑point technical owner coordinating interactions with upstream FEOL/module teams and downstream packaging, test, and product engineering functions.
Lead development and integration of new BEOL and packaging‑enabling process features, including but not limited to: Metal‑Insulator‑Metal (MIM) decoupling capacitors (high‑density and high‑performance variants) Through‑Silicon Via (TSV) and 3DIC integration schemes Backend passive structures, redistribution layers, bonding interfaces, and thermal/warpage mitigation features
Translate system‑level product requirements into robust BEOL integration solutions that enable next‑generation mobile, HPC, and advanced compute products.
Drive cross‑technology process synergy strategies, aligning process integration, module development, tool selection, and manufacturing systems to achieve optimal performance, cost, and scalability.
Act as a technical integrator across virtual factories, partner fabs, and global TD organizations to ensure consistent execution and fast issue resolution.
Represent integration expertise in core teams, working groups, design‑technology co‑optimization (DTCO) forums, and executive technical reviews.
Lead large‑scale, cross‑flow defect reduction initiatives across BEOL, coordinating with multiple segment owners to resolve complex interactions affecting yield, reliability, and product robustness.
Apply strong physics‑based root cause analysis and integration trade‑off judgment to drive sustained yield learning and manufacturability improvements.
Define qualification strategies, reliability requirements, and implementation plans for complex BEOL process changes and new technology features.
Drive technology transfer from TD into HVM, ensuring solutions are manufacturable, scalable, and production‑ready for high‑volume logic fabs.
Support Process Design Kit (PDK) development, documentation, and customer enablement for new BEOL features and technology definitions.
Execute development programs with urgency to meet aggressive internal milestones and external customer commitments in a foundry environment.
Mentor and grow senior integration and module engineers, providing technical guidance, integration strategy direction, and development feedback commensurate with a technical leadership‑level role.