Lead Thermal Mechanical Engineer

Powerlattice Technologies Inc.•Chandler, AZ

17h•$175,000 - $225,000•Hybrid

About The Position

We’re a fast-moving startup building the foundation for next-generation AI compute. We are seeking a hands-on technical leader to develop the next-generation thermal management solutions for advanced power delivery chiplet technologies targeting AI/data center platforms. This role is at the intersection of semiconductor packaging, thermal architecture, mechanical integration, and high-volume manufacturing. You will work closely with internal silicon, package, reliability, and operations teams, while interfacing directly with Tier-1 customers, OSATs, substrate vendors, material suppliers, and ecosystem partners. You will develop novel thermal solutions spanning: Landside cooling architectures, Embedded thermal structures integrated into substrate cores, Novel package-level thermal integration concept. This is an opportunity to work on disruptive semiconductor packaging technology with the potential to redefine power delivery and thermal integration in next-generation computing systems. You will have significant ownership, technical influence, and the ability to shape solutions that could become industry firsts.

Requirements

MS or PhD in Mechanical Engineering, Thermal Engineering, Materials Science, or related field.
10+ years of experience in semiconductor thermal engineering, advanced packaging, or high-performance computing systems.
Experience with thermal and thermo-mechanical simulation tools such as ANSYS, Icepak, COMSOL, Abaqus, or equivalent.
Experience developing thermal solutions for high-power semiconductor devices or advanced packaging applications.
Strong understanding of reliability physics including warpage, CTE mismatch, TIM performance, and thermal cycling.
Knowledge of package assembly processes, substrate manufacturing, and OSAT workflows.

Responsibilities

Drive thermal-mechanical co-design across chiplet, package substrate, cold plate, heatsink, and system-level integration.
Collaborate with package design teams to optimize stack-up, warpage, stiffness, CTE management, and assembly robustness.
Evaluate emerging cooling technologies including direct-to-chip liquid cooling, embedded cooling, vapor chamber integration, and advanced TIM solutions.
Perform detailed thermal and thermo-mechanical simulations using industry-standard tools.
Define integration strategies enabling customer adoption of novel thermal solutions into final package assembly flows.
Collaborate with OSATs, substrate suppliers, thermal solution vendors, and manufacturing partners to enable scalable deployment.